Conference Information
APCCAS 2018: IEEE Asia Pacific Conference on Circuits and Systems
Submission Date:
2018-07-31 Extended
Notification Date:
Conference Date:
Chengdu, China
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Conference Location
Call For Papers
IEEE APCCAS 2018 welcomes author submission of papers concerning any branch of the Circuits and Systems, and their applications ineducation, and other subjects. Topics of interest for submission include any topics on Circuits and Systems.

    Analog Circuits
    Biomedical and Life-Science Circuits, Systemsand Applications
    Circuits and Systems for Communication
    Digital Signal Processing
    Embedded Systems
    Emerging Technologies for Circuits and Systems
    HP/HV IC Designs
    Memory Circuits and Systems
    Mixed Signal Circuits
    Multimedia Systems and Applications
    Nanoelectronics and Gigascale Systems
    Neural Systems and Applications
    Nonlinear Circuits and Systems
    Power and Energy Circuits and Systems
    RF/mm-Wave IC Design and Technology
    Sensory Systems
    System-on-Chip and CAD
    Testing Technology
    Visual Signal Processing and Communications
    VLSI Systems & Applications
    3D IC Design

Submission Track

    Analog and Mixed-Signal Circuits and Systems
    Digital Circuits and Systems
    Power/Energy Devices, Circuits and Systems
    Communication Circuits and Systems
    High-Speed and Optical Wirelined Circuits and Systems
    Biomedical and Healthcare Circuits and Systems
    Digital Signal Processing
    Sensors and Interfaces
    Design Automation
    Nanoelectronics, Devices and Hybrid System Integration
    Neural Networks and Neuromorphic Engineering
    Nonlineary Systems and Circuit Theory
    Visual Signal Processing and Communications
    Multimedia Systems and Applications
    Education in Circuits and Systems
    ▶View the information about each Track Chairs

Special Session - Call for Paper

    Special Session Title: Emerging threats in the IoT era: chip reliability and security

    1. hardware Trojan design and countermeasure
    2. analysis of side and covert channel for both 2D and 3D chips
    3. timing, reliability, variability, power-related attacks for IoT chips
    4. secure and trustworthy IoT chip architecture
    5. ultra low power and reliable IoT chip design

    Special Session Title: Reconfigurable Architecture for Future Intelligent Systems (Read More)

    1. FPGA based reconfigurable AI accelerator;
    2. Systematic design for intelligent applications using FPGA based solution;
    3. FPGA-based low-power objective detection and analysis for automatic driving and computer vision;
    4. Reconfigurable architecture with FPGA verfication;
    5. FPGA based heterogeneous computing platform;
Last updated by Dou Sun in 2018-07-29
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