Información de la conferencia
APCCAS 2018: IEEE Asia Pacific Conference on Circuits and Systems
http://apccas.com/index.htmlDía de Entrega: |
2018-07-31 Extended |
Fecha de Notificación: |
2018-08-30 |
Fecha de Conferencia: |
2018-10-26 |
Ubicación: |
Chengdu, China |
Años: |
14 |
Vistas: 21727 Seguidores: 4 Asistentes: 0
Solicitud de Artículos
IEEE APCCAS 2018 welcomes author submission of papers concerning any branch of the Circuits and Systems, and their applications ineducation, and other subjects. Topics of interest for submission include any topics on Circuits and Systems.
Analog Circuits
Biomedical and Life-Science Circuits, Systemsand Applications
Circuits and Systems for Communication
Digital Signal Processing
Embedded Systems
Emerging Technologies for Circuits and Systems
HP/HV IC Designs
Memory Circuits and Systems
Mixed Signal Circuits
Multimedia Systems and Applications
Nanoelectronics and Gigascale Systems
Neural Systems and Applications
Nonlinear Circuits and Systems
Power and Energy Circuits and Systems
RF/mm-Wave IC Design and Technology
Sensory Systems
System-on-Chip and CAD
Testing Technology
Visual Signal Processing and Communications
VLSI Systems & Applications
3D IC Design
LIVE DEMO
Submission Track
Analog and Mixed-Signal Circuits and Systems
Digital Circuits and Systems
Power/Energy Devices, Circuits and Systems
Communication Circuits and Systems
High-Speed and Optical Wirelined Circuits and Systems
Biomedical and Healthcare Circuits and Systems
Digital Signal Processing
Sensors and Interfaces
Design Automation
Nanoelectronics, Devices and Hybrid System Integration
Neural Networks and Neuromorphic Engineering
Nonlineary Systems and Circuit Theory
Visual Signal Processing and Communications
Multimedia Systems and Applications
Education in Circuits and Systems
▶View the information about each Track Chairs
Special Session - Call for Paper
Special Session Title: Emerging threats in the IoT era: chip reliability and security
Topic:
1. hardware Trojan design and countermeasure
2. analysis of side and covert channel for both 2D and 3D chips
3. timing, reliability, variability, power-related attacks for IoT chips
4. secure and trustworthy IoT chip architecture
5. ultra low power and reliable IoT chip design
Special Session Title: Reconfigurable Architecture for Future Intelligent Systems (Read More)
Topic:
1. FPGA based reconfigurable AI accelerator;
2. Systematic design for intelligent applications using FPGA based solution;
3. FPGA-based low-power objective detection and analysis for automatic driving and computer vision;
4. Reconfigurable architecture with FPGA verfication;
5. FPGA based heterogeneous computing platform;
Última Actualización Por Dou Sun en 2018-07-29
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Revistas Relacionadas
| CCF | Nombre Completo | Factor de Impacto | Editor | ISSN |
|---|---|---|---|---|
| Ocean Modelling | 3.100 | Elsevier | 1463-5003 | |
| Computers & Structures | 4.400 | Elsevier | 0045-7949 | |
| Computers & Chemical Engineering | 3.900 | Elsevier | 0098-1354 | |
| Microsystem Technologies | 1.600 | Springer | 0946-7076 | |
| Journal of Manufacturing Processes | 6.100 | Elsevier | 1526-6125 | |
| Smart Learning Environments | 12.1 | Springer | 2196-7091 | |
| Security Informatics | Springer | 2190-8532 | ||
| c | IET Information Security | 1.300 | IET | 1751-8709 |
| Archival Science | 1.400 | Springer | 1389-0166 | |
| b | World Wide Web | 2.700 | Springer | 1386-145X |
| Nombre Completo | Factor de Impacto | Editor |
|---|---|---|
| Ocean Modelling | 3.100 | Elsevier |
| Computers & Structures | 4.400 | Elsevier |
| Computers & Chemical Engineering | 3.900 | Elsevier |
| Microsystem Technologies | 1.600 | Springer |
| Journal of Manufacturing Processes | 6.100 | Elsevier |
| Smart Learning Environments | 12.1 | Springer |
| Security Informatics | Springer | |
| IET Information Security | 1.300 | IET |
| Archival Science | 1.400 | Springer |
| World Wide Web | 2.700 | Springer |