会议信息

ICICDT 2016: International Conference on IC Design and Technology

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截稿日期:
2016-03-13 已截稿
通知日期:
2016-03-31
会议日期:
2016-06-27
会议地点:
Ho Chi Minh City, Vietnam
届数:
9
浏览: 22194   关注: 1   参加: 0
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ICICDT
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会伴指数 (CP-I)

45.1 / 100
全站第 2,931 名 / 共 5,768 个会议 · 前 51%
学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
62
社区关注 (10%)
15
资料公开度 (15%)
25

用到的输入: 有据可查的届次：9 · 在会伴关注它的研究者：1 人 · 过去 24 个月打开过本页的研究者：2 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后，可直接在这一页补上；分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.2 · 算于 2026-11-04

征稿

ICICDT 2016 (International Conference on IC Design and Technology) is an academic conference held in Ho Chi Minh City, Vietnam on 2016-06-27. The paper submission deadline is 2016-03-13. Acceptance notifications are sent on 2016-03-31.

On behalf of the technical program and organizing committees, we welcome you to the 2016 IEEE International Conference on Integrated Circuit Design and Technology (ICICDT). Integrated circuit (IC) engineering roles have traditionally been separated along the boundary between design and technology. As IC products advance toward higher performance and better energy efficiency while the time to market continues to accelerate, future IC engineers will require a deeper understanding of the interdependencies between design and technology to expand the product optimization window. ICICDT is the forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary through interactions with design, technology, and process experts to develop the skills for future IC research and development. The 2016 conference is a joint event between the ICICDT-2016 and the 4th Solid State Systems Symposium – VLSIs and Semiconductor Related Technologies (4S-2016). The unique workshop style of the conference fosters an environment for exchanging breakthrough ideas and collaborating effectively. A one-day tutorial program for both the beginner and expert precedes two days of technical presentations and workshops. The 2016 ICICDT topics include: Advanced materials and processing technologies Advanced transistor and interconnect structures Three-dimensional (3D) integration Variation-tolerant designs Process and design techniques for soft errors, plasma-induced damage, and reliability Advanced memory devices and circuits RF, analog, mixed signal, and I/O circuits for future technology generations Simulation and modeling of advanced processes, devices, and circuits EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability Design for manufacturing, yield, and test System-on-Chip (SoC) and system-in-package (SiP) design integration Power semiconductor technologies and circuits Emerging technologies and circuits
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