ICICDT 2016 (International Conference on IC Design and Technology) is an academic conference held in Ho Chi Minh City, Vietnam on 2016-06-27. The paper submission deadline is 2016-03-13. Acceptance notifications are sent on 2016-03-31.
On behalf of the technical program and organizing committees, we welcome you to the 2016 IEEE International Conference on Integrated Circuit Design and Technology (ICICDT). Integrated circuit (IC) engineering roles have traditionally been separated along the boundary between design and technology. As IC products advance toward higher performance and better energy efficiency while the time to market continues to accelerate, future IC engineers will require a deeper understanding of the interdependencies between design and technology to expand the product optimization window. ICICDT is the forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary through interactions with design, technology, and process experts to develop the skills for future IC research and development. The 2016 conference is a joint event between the ICICDT-2016 and the 4th Solid State Systems Symposium – VLSIs and Semiconductor Related Technologies (4S-2016). The unique workshop style of the conference fosters an environment for exchanging breakthrough ideas and collaborating effectively. A one-day tutorial program for both the beginner and expert precedes two days of technical presentations and workshops. The 2016 ICICDT topics include:
Advanced materials and processing technologies
Advanced transistor and interconnect structures
Three-dimensional (3D) integration
Variation-tolerant designs
Process and design techniques for soft errors, plasma-induced damage, and reliability
Advanced memory devices and circuits
RF, analog, mixed signal, and I/O circuits for future technology generations
Simulation and modeling of advanced processes, devices, and circuits
EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
Design for manufacturing, yield, and test
System-on-Chip (SoC) and system-in-package (SiP) design integration
Power semiconductor technologies and circuits
Emerging technologies and circuits
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