会议信息
ICICDT 2016: International Conference on IC Design and Technology
http://www.icicdt.org/
截稿日期:
2016-03-13
通知日期:
2016-03-31
会议日期:
2016-06-27
会议地点:
Ho Chi Minh City, Vietnam
届数:
9
浏览: 15231   关注: 1   参加: 0

征稿
On behalf of the technical program and organizing committees, we welcome you to the 2016 IEEE International Conference on Integrated Circuit Design and Technology (ICICDT). Integrated circuit (IC) engineering roles have traditionally been separated along the boundary between design and technology. As IC products advance toward higher performance and better energy efficiency while the time to market continues to accelerate, future IC engineers will require a deeper understanding of the interdependencies between design and technology to expand the product optimization window. ICICDT is the forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary through interactions with design, technology, and process experts to develop the skills for future IC research and development. The 2016 conference is a joint event between the ICICDT-2016 and the 4th Solid State Systems Symposium – VLSIs and Semiconductor Related Technologies (4S-2016). The unique workshop style of the conference fosters an environment for exchanging breakthrough ideas and collaborating effectively. A one-day tutorial program for both the beginner and expert precedes two days of technical presentations and workshops. The 2016 ICICDT topics include:

    Advanced materials and processing technologies
    Advanced transistor and interconnect structures
    Three-dimensional (3D) integration
    Variation-tolerant designs
    Process and design techniques for soft errors, plasma-induced damage, and reliability
    Advanced memory devices and circuits
    RF, analog, mixed signal, and I/O circuits for future technology generations
    Simulation and modeling of advanced processes, devices, and circuits
    EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
    Design for manufacturing, yield, and test
    System-on-Chip (SoC) and system-in-package (SiP) design integration
    Power semiconductor technologies and circuits
    Emerging technologies and circuits
最后更新 Dou Sun 在 2016-03-05
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