System-on-Chip (SoC) and System-in-Package (SiP) devices, comprising digital, analog, optical, RF, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC). Such systems will provide solutions in communication, entertainment, medical and smart mobility technologies underpinning emerging “Digital Societies”. Recent advances in systems, packaging and process technologies are enabling the computation of hundreds of teraflops per chip and chiplet system integration unleashing the massive rise of AI-based edge devices, various accelerators, new products and applications. This enormous demand for computing per silicon-based SoC and SiP integration creates new challenges with respect to storage, memory, security, reliability, power, on- and off-chip communication, packaging including reliable design and verification.

For more than 36 years the IEEE International System-on-Chip Conference (SOCC) has been a premier forum for sharing latest advancements in SoC architectures, systems, logic and circuit design, process technology, test, design tools, and application scenarios. We consequently continue this tradition with the 2024 conference at the heart of “Silicon Saxony” in Dresden, Germany.