Conference Information

ICMMC 2027: International Conference on Microwave and Microelectronics of Communications

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Submission Date:
2027-04-10 Due in 175 days
Notification Date:
2027-04-25
Conference Date:
2027-08-13
Location:
Xining, China
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Call For Papers

ICMMC 2027 (International Conference on Microwave and Microelectronics of Communications) is an academic conference held in Xining, China on 2027-08-13. The paper submission deadline is 2027-04-10. Acceptance notifications are sent on 2027-04-25.

The 2027 International Conference on Microwave and Microelectronics of Communications (2027 ICMMC) will take place in Xining(Beijing), China, from August 13 to 15, 2027. The 2027 International Conference on Microwave and Microelectronics of Communications (2027 ICMMC) is an annual international academic conference hosted by the Microwave Technology Committee of the China Institute of Communications (CIC). It aims to provide a high-level academic exchange platform for scholars, researchers, engineers and students worldwide in the field of electromagnetics. The conference focuses on the research and application of cutting-edge areas including computational electromagnetics, antenna technology, microwave engineering, electromagnetic compatibility, RF and microwave circuit design, electromagnetic materials, and communication microelectronics, and promotes the innovation and development of electromagnetic and microwave theories and technologies. We look forward to welcoming you to Xining for the 2027 ICMMC. Accepted and presented papers will be submitted for inclusion in IEEE Xplore® Digital Library, subject to meeting IEEE’s quality and scope requirements. Topics Topics Focused on but not limited to the following areas: 1.AI-Enabled Microwave and Communication Technologies Machine learning for electromagnetic analysis, AI-driven antenna and circuit design, Data-driven electromagnetic modeling, Intelligent electromagnetic systems, AI for communication signal processing and resource management, etc. 2.Electromagnetics for Industrial and Defense Applications Radar and sensing systems, Satellite and space communications, High-power microwave technologies, Electromagnetic protection and defense applications, etc. 3.RF circuits and subsystems RF integrated transmitters, receivers and transceivers; RF and monolithic microwave integrated circuits (RFIC and MMIC): PAs, LNAs, VCOs, PLLs, mixers, filters and RF switches, etc. Digital RFIC, digital beam-forming, reconfigurable circuits. 4.Microwave and millimeter wave system-on-chip Advances in SoC for communication systems, incl. 5G/6G, WLAN, UWB, IoTs, satellite communication, healthcare and biomedical systems, body area networks, short-range-radio, etc. 5.Semiconductor device technologies Microwave devices on silicon, III/V and 3rd/4th generation semiconductor technologies, high power RF components, device modeling characterization, parameter extraction, reliability and calibration, etc. 6.Packaging technologies Antenna-in-Package (AiP) and chip–antenna co-design, chiplet, subsystem packaging, assembly methods, multi-chip modules, wafer stacking, 3D interconnect, package EM modeling/co-simulation, etc. 7.Electromagnetic Materials and Metamaterials for Communication Systems Metamaterials and metasurfaces, Intelligent and programmable electromagnetic materials, Functional and advanced electromagnetic materials, Quantum electromagnetic materials and devices, and their role in enhancing communication system performance, etc. 8.Terahertz circuits and systems Terahertz circuit design, terahertz communications, terahertz radar imaging, 6G terahertz channel modeling, Integrated sensing and communication (ISAC), etc. 9.Interdisciplinary researches Circuits for microwave photonics, Communications for life safety, Human body communication, Medical electronics and biomedical applications, Low-altitude economy communications, Emergency communications, etc. 10.Special Sessions and Forums Workshops: Including dedicated sessions such as "Women in Microwave Communications." Industry Forum: Focusing on practical scenarios and challenges, featuring perspectives from leading companies and operator.
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