Conference Information

STEE 2026: International Conference on Smart Technologies in Power Engineering and Electronics

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Submission Date:
2025-12-15
Notification Date:
2026-03-15
Conference Date:
2026-04-27
Location:
Kyiv, Ukraine
Years:
8
Viewed: 2294   Tracked: 0   Attend: 0

Conference Partner Index (CP-I)

45.6 / 100
Ranked #2,538 of 5,645 conferences · Top 45%

#62 of 296 in Energy & Environment #183 of 507 in Electrical & Electronic Engineering

Academic recognition (35%) No data - scored at the neutral baseline of 50
Submission selectivity (20%) No data - scored at the neutral baseline of 50
Editions held (20%)
59
Community attention (10%)
10
Public record completeness (15%)
35

Inputs used: Editions on record: 8 · Researchers who opened this page in the past 24 months: 3

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-09-01

Call For Papers

STEE 2026 (International Conference on Smart Technologies in Power Engineering and Electronics) is an academic conference held in Kyiv, Ukraine on 2026-04-27. The paper submission deadline is 2025-12-15. Acceptance notifications are sent on 2026-03-15.

The purpose of the conference is to provide a multidisciplinary platform for researchers, engineers, and industry professionals to present and discuss the latest innovations, trends, challenges, and solutions in the fields of Power and Industrial Electronics, Acoustics and Multimedia Systems, and Electronic Components and Manufacturing Technologies. By covering a broad spectrum of technical tracks — including advanced power conversion systems, intelligent control in energy systems, acoustic signal processing, multimedia technologies, cutting-edge electronic materials, and packaging innovations — the conference aims to foster collaboration, knowledge exchange, and the development of future technologies across academia and industry. Conference technical tracks TT1 – Power and Industrial Electronics Key words: DC-to-DC converters, AC-to-AC converters, Rectifiers, Inverters, Multilevel Converters; Drives, Energy Storages, Batteries, Chargers, Unconventional Power Electronics Converters; Power Electronics for Automotive Vehicles, Aircrafts, and Ships, Welding Machines; Converters’ Control, Energy and Power System Control, Intelligent and Predictive Control in Power Electronics; Quality and Reliability in Power Systems, Electromagnetic Compatibility; Filters and Compensators, Active Power Quality Controllers. TT2 – Acoustics, Multimedia and Speech Processing Key words: Acoustic Engineering, Audio Engineering, Acoustic Systems, Processing of Acoustic Signals; Electroacoustic Devices and Systems, Acoustic Non-Destructive Testing, Acoustic Monitoring; Multimedia, Video and Image Processing, Image Transmission; Hydroacoustics, Ultrasonic Diagnostics, Medical Acoustics; Objective Hearing Diagnostic, Audiological Screening; Ultrasonic Transducers, Broadband Electroacoustic Transducers; Piezoelectricity; Acoustics Waves, Doppler Effect, Acoustic Sensors, Noise. TT3 – Electronic Components, Packaging and Manufacturing Technology Key words: Modeling and Design in Electronics; Physical Testing, Thermal Management; Advanced Electronic Materials; Manufacturing, and Reliability of Electronics, Photonics, RF, MEMS, SAW-devises and Sensor Packaging; Integration to Ensure Electrical, Thermal, Thermo-mechanical, Electromagnetic Performance and Security.
Last updated by Dou Sun on

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