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STEE 2026: International Conference on Smart Technologies in Power Engineering and Electronics

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STEE
Día de Entrega:
2025-12-15
Fecha de Notificación:
2026-03-15
Fecha de conferencia:
2026-04-27
Ubicación:
Kyiv, Ukraine
Ediciones:
8
Vistas: 2038   Seguidores: 0   Asistentes: 0

Solicitud de Artículos

STEE 2026 (International Conference on Smart Technologies in Power Engineering and Electronics) is an academic conference held in Kyiv, Ukraine on 2026-04-27. The paper submission deadline is 2025-12-15. Acceptance notifications are sent on 2026-03-15.

The purpose of the conference is to provide a multidisciplinary platform for researchers, engineers, and industry professionals to present and discuss the latest innovations, trends, challenges, and solutions in the fields of Power and Industrial Electronics, Acoustics and Multimedia Systems, and Electronic Components and Manufacturing Technologies. By covering a broad spectrum of technical tracks — including advanced power conversion systems, intelligent control in energy systems, acoustic signal processing, multimedia technologies, cutting-edge electronic materials, and packaging innovations — the conference aims to foster collaboration, knowledge exchange, and the development of future technologies across academia and industry. Conference technical tracks TT1 – Power and Industrial Electronics Key words: DC-to-DC converters, AC-to-AC converters, Rectifiers, Inverters, Multilevel Converters; Drives, Energy Storages, Batteries, Chargers, Unconventional Power Electronics Converters; Power Electronics for Automotive Vehicles, Aircrafts, and Ships, Welding Machines; Converters’ Control, Energy and Power System Control, Intelligent and Predictive Control in Power Electronics; Quality and Reliability in Power Systems, Electromagnetic Compatibility; Filters and Compensators, Active Power Quality Controllers. TT2 – Acoustics, Multimedia and Speech Processing Key words: Acoustic Engineering, Audio Engineering, Acoustic Systems, Processing of Acoustic Signals; Electroacoustic Devices and Systems, Acoustic Non-Destructive Testing, Acoustic Monitoring; Multimedia, Video and Image Processing, Image Transmission; Hydroacoustics, Ultrasonic Diagnostics, Medical Acoustics; Objective Hearing Diagnostic, Audiological Screening; Ultrasonic Transducers, Broadband Electroacoustic Transducers; Piezoelectricity; Acoustics Waves, Doppler Effect, Acoustic Sensors, Noise. TT3 – Electronic Components, Packaging and Manufacturing Technology Key words: Modeling and Design in Electronics; Physical Testing, Thermal Management; Advanced Electronic Materials; Manufacturing, and Reliability of Electronics, Photonics, RF, MEMS, SAW-devises and Sensor Packaging; Integration to Ensure Electrical, Thermal, Thermo-mechanical, Electromagnetic Performance and Security.
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Revistas Relacionadas

CCFNombre CompletoFactor de ImpactoEditorISSN
AIEEE Transactions on Multimedia9.7IEEE1520-9210
CKnowledge-Based Systems7.2Elsevier0950-7051
BSoftware & Systems Modeling3.2Springer1619-1366
AIEEE Transactions on Computers3.8IEEE0018-9340
CFuture Generation Computer Systems6.1Elsevier0167-739X
CNeurocomputing6.5Elsevier0925-2312
CPattern Recognition Letters3.9Elsevier0167-8655
BPattern Recognition7.6Elsevier0031-3203
IEEE Access3.6IEEE2169-3536
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