Información de la conferencia

ESREF 2026: European Symposium on Reliability of Electron Devices, Failure Physics and Analysis

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Día de Entrega:
2026-03-20
Fecha de Notificación:
Fecha de Conferencia:
2026-09-21
Ubicación:
Vienna, Austria
Años:
37
Vistas: 2411   Seguidores: 0   Asistentes: 0

Solicitud de Artículos

ESREF 2026 (European Symposium on Reliability of Electron Devices, Failure Physics and Analysis) is an academic conference held in Vienna, Austria on 2026-09-21. The paper submission deadline is 2026-03-20.

We are delighted to welcome you to the 37th edition of ESREF, hosted in the historic and culturally rich city of Vienna, Austria, by the Institute for Microelectronics at TU Wien. As a city known for its long-standing contributions to science, engineering, and innovation, Vienna provides an inspiring stage for this international symposium of reliability experts. Over the decades, ESREF has grown into a leading forum for the exchange of cutting-edge research, innovative ideas, and technological advancements in the field of micro- and nanoelectronics. This year’s conference proudly continues that tradition, bringing together researchers and professionals from both academia and industry who are shaping the future of innovations in electronic devices and failure analysis. The program spans ten specialized tracks, covering a wide range of timely and important topics, including reliability assessment, reliability of nanoelectronics, advances in failure analysis, power device reliability, photonics, MEMS and sensors’ reliability, as well as electronics for extreme environments. Together, these sessions reflect the diversity and depth of research in our field, from novel materials and failure mechanisms to robust design strategies and applications which must perform reliably under demanding conditions. As we gather here in Vienna, we are reminded of the critical importance of collaboration and knowledge sharing in driving progress and addressing the challenges of modern electronics. We look forward to insightful presentations, engaging discussions, and meaningful connections that will extend far beyond this event.
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