Conference Information

CMAIR 2023: International Conference on Mechatronics, Artificial Intelligence and Robotics

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Submission Date:
2023-11-30
Notification Date:
2023-12-07
Conference Date:
2023-12-15
Location:
Chengdu, China
Years:
2
Viewed: 9915   Tracked: 1   Attend: 3

Call For Papers

CMAIR 2023 (International Conference on Mechatronics, Artificial Intelligence and Robotics) is an academic conference held in Chengdu, China on 2023-12-15. The paper submission deadline is 2023-11-30. Acceptance notifications are sent on 2023-12-07.

2023 2nd International Conference on Mechatronics, Artificial Intelligence and Robotics (CMAIR 2023) will be held in Chengdu, Sichuan during December 15-17, 2023. It is sponsored by The International Society for Applied Computing (ISAC) and The Technical Institute for Engineers (T.I.E.). We fully understand some participants cannot attend the conference in-person due to COVID-19, so we will hold our conference both online and in-person, thus you could attend the conference online and do the online presentation (因疫情影响，无法到现场参会的作者，可参加我们的线上会议和做线上报告). CMAIR 2023 is intended as an international forum to bring together academicians, scientists, engineers, and researchers working in the fields of Mechatronics, Artificial Intelligence and Robotics to exchange views, share their expertise, experience and research results, and discuss the challenges and future directions in their specialized areas. During the upcoming conference, the invited renowned professors will share with us the recent innovations in the fields of Mechatronics, Artificial Intelligence and Robotics. The conference will mainly feature on keynote speeches as well as peer-reviewed paper presentations. In addition, social program or academic visit will be arranged to encourage communication, discussion or cooperation among the researchers in this field. We invite submissions of papers presenting an original high-quality research and development for the conference. All papers must be written in English and will be peer-reviewed by technical committees of the Conference and all accepted papers will be published in the conference proceedings.
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