Conference Information
INTERCON 2020: International Conference on Electronics, Electrical Engineering and Computing
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Lima, Peru
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The 2020 IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.

2020 INTERCON will be held in Lima, Peru, the Gastronomic Capital of Latin America and World Heritage Site by UNESCO. Museums with great works of art, archaeological sites, beaches, the boardwalk, valleys, natural reserves, the nightlife, the thrill of adventure sports and the exquisite cuisine gives Peru’s capital an authentic personality and makes tourism in Lima a unique experience in the country.

2020 INTERCON will be hosted at TECSUP in Santa Anita, which is located on the eastern part of Lima’s City Center. Between the streets Los Nogales and Alcanfores you find the Huaca Perales, built by to the Huancho Culture.

The topics include, but they are not limited to:

    Communication systems
    Semiconductor and devices
    Computers and information technology
    Signal processing
    Systems and control
    Emerging technologies
    Circuits and systems
    Power generation, transmission and distribution
    Renewable energy sources, smartgrids technologies and applications
    Power electronics, systems and applications
    Electrical machines and adjustable speed drives
    High voltage engineering and insulation technology
    Algorithms and complexity
    Architecture and organization
    Graphics and visualization
    Information management, assurance and security
    Intelligent systems
    Parallel and distributed Computing
    Software engineering
    Social issues and professional practice
Last updated by Dou Sun in 2020-04-01
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