会议信息

INTERCON 2021: International Conference on Electronics, Electrical Engineering and Computing

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截稿日期:
2021-05-15
通知日期:
2021-06-30
会议日期:
2021-08-05
会议地点:
Online
届数:
28
浏览: 14844   关注: 1   参加: 0

征稿

INTERCON 2021 (International Conference on Electronics, Electrical Engineering and Computing) is an academic conference held in Online on 2021-08-05. The paper submission deadline is 2021-05-15. Acceptance notifications are sent on 2021-06-30.

The 2021 IEEE XXVIII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity. CFP INTERCON 2021 has been redesigned in a virtual environment, for the safety of our community and to offer an inclusive experience. For oral presentations, will use teleconferences tools to prepare interactive presentation sessions. Remote hosts will use a common remote presence software tool which will be determined and announced by the organizing committee. The topics include, but they are not limited to: Communication systems Semiconductor and devices Computers and information technology Signal processing Systems and control Emerging technologies Circuits and systems Power generation, transmission and distribution Renewable energy sources, smartgrids technologies and applications Power electronics, systems and applications Electrical machines and adjustable speed drives High voltage engineering and insulation technology Algorithms and complexity Architecture and organization Graphics and visualization Information management, assurance and security Intelligent systems Parallel and distributed Computing Software engineering Social issues and professional practice
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Yizhong Liu (1265)
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