会议信息

ICCSD 2026: International Conference on Circuits, Systems and Devices

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截稿日期:
2026-07-10
通知日期:
2026-08-10
会议日期:
2026-11-13
会议地点:
Ningbo, China
届数:
6
浏览: 17476   关注: 1   参加: 0

会伴指数 (CP-I)

45.5 / 100
全站第 2,734 名 / 共 5,687 个会议 · 前 49%

电气与电子工程 第 213 / 510

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
52
社区关注 (10%)
22
资料公开度 (15%)
35

用到的输入: 有据可查的届次:6 · 在会伴关注它的研究者:1 人 · 过去 24 个月打开过本页的研究者:7 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后,可直接在这一页补上;分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据,而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-09-27

征稿

ICCSD 2026 (International Conference on Circuits, Systems and Devices) is an academic conference held in Ningbo, China on 2026-11-13. The paper submission deadline is 2026-07-10. Acceptance notifications are sent on 2026-08-10.

ICCSD will provide a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Circuits, Devices and Systems. Topics for submission include, but are not limited to: Advanced Transistors(GAAFETs/ VSAFETs) Wide Bandgap Semiconductor Devices Quantum Devices Compound Semiconductor Devices Spintronic Devices Insulated-Gate Bipolar Transistor (IGBT) Power MOSFET Silicon Carbide(SiC) Nano Energy Devices Energy Conversion Devices Energy Harvesting Technology DC-DC Converter Power Management & Energy Efficient Technology Bio/Gas/Thermal/Voltage/Current Sensors Vision Intelligence & Image Sensors Acoustic Sensors Display Technology & Devices Photoelectric Conversion & Optical Fiber Sensing Power Amplifiers Mixer & Microwave Sources Terahertz Devices Magnetic Devices Electromagnetic Components Antenna Design Terahertz Sensing and Imaging Computational Electromagnetics System in Package(SiP) Through Glass Via & Through Silicon Via 3D Integration Technology High Density Packaging CAD Tools for Packing Microelectromechanical Systems Photoelectric Fusion Module Chiplets Based Microsystems Wafer-Scale Integration & System on Wafer Nonvolatile Memory Computing in Memory Emerging Memory Technologies Clock Generator and Management Physical Modeling for VLSI Design Placement & Routing Algorithm Evaluation Methods for VLSI Reliability Aging Prediction & Mitigation
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