Conference Information

ICCSD 2026: International Conference on Circuits, Systems and Devices

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Submission Date:
2026-07-10
Notification Date:
2026-08-10
Conference Date:
2026-11-13
Location:
Ningbo, China
Years:
6
Viewed: 17473   Tracked: 1   Attend: 0

Conference Partner Index (CP-I)

45.5 / 100
Ranked #2,734 of 5,687 conferences · Top 49%

#213 of 510 in Electrical & Electronic Engineering

Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%)
52
Community attention (10%)
22
Public record completeness (15%)
35

Inputs used: Editions on record: 6 · Researchers following it here: 1 · Researchers who opened this page in the past 24 months: 7

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-09-27

Call For Papers

ICCSD 2026 (International Conference on Circuits, Systems and Devices) is an academic conference held in Ningbo, China on 2026-11-13. The paper submission deadline is 2026-07-10. Acceptance notifications are sent on 2026-08-10.

ICCSD will provide a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Circuits, Devices and Systems. Topics for submission include, but are not limited to: Advanced Transistors(GAAFETs/ VSAFETs) Wide Bandgap Semiconductor Devices Quantum Devices Compound Semiconductor Devices Spintronic Devices Insulated-Gate Bipolar Transistor (IGBT) Power MOSFET Silicon Carbide(SiC) Nano Energy Devices Energy Conversion Devices Energy Harvesting Technology DC-DC Converter Power Management & Energy Efficient Technology Bio/Gas/Thermal/Voltage/Current Sensors Vision Intelligence & Image Sensors Acoustic Sensors Display Technology & Devices Photoelectric Conversion & Optical Fiber Sensing Power Amplifiers Mixer & Microwave Sources Terahertz Devices Magnetic Devices Electromagnetic Components Antenna Design Terahertz Sensing and Imaging Computational Electromagnetics System in Package(SiP) Through Glass Via & Through Silicon Via 3D Integration Technology High Density Packaging CAD Tools for Packing Microelectromechanical Systems Photoelectric Fusion Module Chiplets Based Microsystems Wafer-Scale Integration & System on Wafer Nonvolatile Memory Computing in Memory Emerging Memory Technologies Clock Generator and Management Physical Modeling for VLSI Design Placement & Routing Algorithm Evaluation Methods for VLSI Reliability Aging Prediction & Mitigation
Last updated by Dou Sun on

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