会议信息

OEMR 2017: International Meeting on Opto-Electronics Engineering and Materials Research

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OEMR
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截稿日期:
2017-07-01
通知日期:
2017-07-05
会议日期:
2017-07-15
会议地点:
Shenyang, China
届数:
6
浏览: 14859   关注: 1   参加: 0

会伴指数 (CP-I)

43.2 / 100
全站第 3,674 名 / 共 5,682 个会议 · 前 65%

材料、机械与制造 第 113 / 260 电气与电子工程 第 301 / 509

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
52
社区关注 (10%)
15
资料公开度 (15%)
25

用到的输入: 有据可查的届次：6 · 在会伴关注它的研究者：1 人 · 过去 24 个月打开过本页的研究者：2 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后，可直接在这一页补上；分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-09-20

征稿

OEMR 2017 (International Meeting on Opto-Electronics Engineering and Materials Research) is an academic conference held in Shenyang, China on 2017-07-15. The paper submission deadline is 2017-07-01. Acceptance notifications are sent on 2017-07-05.

Topics of interest for submission include, but are not limited to: 1. Optoelectronic Technology and Applications Laser Physics Gas Lasers and Applications Solid State Lasers Technology and Devices Laser application Optoelectronic instrumentation, measurement and metrology Imaging system and image processing Photonic detector technology Infrared imaging and applications Spectroscopy technology and applications Optical passive/active components Optical network and applications Nonlinear Optics optical fiber sensors NanoMaterials Nanoscale Modeling NanoFabrication Simulation and Devices THz generation and detection THz photonic devices THz spectroscopy and imaging THz communication and radar THz wave for biomedical application THz non-destructive testing Interaction of THz radiation with matters 2. Electronics Engineering Electrical Power Computer and wireless networks Database and data mining applications Software Engineering Artificial Intelligence Multimedia Information Security Telecommunication Computer Science and Engineering Biotechnology Information Science Electronics Control Systems and Robotics Signal Processing Circuits and Systems Electromagnetics Electrical Materials Mechatronics Sensors and instrumentation Biomedical electronics Micro-electronics and Integrated-circuit Technology Signal and Image Processing Wireless Net Sensors Pattern Recognition Other Related Fields 3. Applied Materials Electronic Materials and Applications Laser Materials, Fabrication and Characterization Materials behavior Casting and solidification Biobased Materials Biobased Composites and Nanocomposites Powder metallurgy and ceramic forming Electronic packaging technology and materials Smart materials and structures Electronic materials and embedded software Surface, subsurface, and interface phenomena Coatings and surface engineering Composite materials Materials forming Energy Conversion and Storage Materials Nanomaterials Composites and polymer materials Biomaterials Semi-conductor and micro-electronic materials Smart/Intelligent Materials/Intelligent Systems Thin Films New Functional Materials Metal alloy materials Iron and Steel Building Materials Coatings and surface engineering Materials Characterization Mechanical Behavior & Fracture Testing and Evaluation of Materials
由 Dou Sun 最后更新于

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