会議情報

OEMR 2017: International Meeting on Opto-Electronics Engineering and Materials Research

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OEMR
投稿締切日:
2017-07-01
通知日:
2017-07-05
開催日:
2017-07-15
開催地:
Shenyang, China
開催回数:
6
閲覧: 14566   フォロー: 1   参加: 0

論文募集

OEMR 2017 (International Meeting on Opto-Electronics Engineering and Materials Research) is an academic conference held in Shenyang, China on 2017-07-15. The paper submission deadline is 2017-07-01. Acceptance notifications are sent on 2017-07-05.

Topics of interest for submission include, but are not limited to: 1. Optoelectronic Technology and Applications Laser Physics Gas Lasers and Applications Solid State Lasers Technology and Devices Laser application Optoelectronic instrumentation, measurement and metrology Imaging system and image processing Photonic detector technology Infrared imaging and applications Spectroscopy technology and applications Optical passive/active components Optical network and applications Nonlinear Optics optical fiber sensors NanoMaterials Nanoscale Modeling NanoFabrication Simulation and Devices THz generation and detection THz photonic devices THz spectroscopy and imaging THz communication and radar THz wave for biomedical application THz non-destructive testing Interaction of THz radiation with matters 2. Electronics Engineering Electrical Power Computer and wireless networks Database and data mining applications Software Engineering Artificial Intelligence Multimedia Information Security Telecommunication Computer Science and Engineering Biotechnology Information Science Electronics Control Systems and Robotics Signal Processing Circuits and Systems Electromagnetics Electrical Materials Mechatronics Sensors and instrumentation Biomedical electronics Micro-electronics and Integrated-circuit Technology Signal and Image Processing Wireless Net Sensors Pattern Recognition Other Related Fields 3. Applied Materials Electronic Materials and Applications Laser Materials, Fabrication and Characterization Materials behavior Casting and solidification Biobased Materials Biobased Composites and Nanocomposites Powder metallurgy and ceramic forming Electronic packaging technology and materials Smart materials and structures Electronic materials and embedded software Surface, subsurface, and interface phenomena Coatings and surface engineering Composite materials Materials forming Energy Conversion and Storage Materials Nanomaterials Composites and polymer materials Biomaterials Semi-conductor and micro-electronic materials Smart/Intelligent Materials/Intelligent Systems Thin Films New Functional Materials Metal alloy materials Iron and Steel Building Materials Coatings and surface engineering Materials Characterization Mechanical Behavior & Fracture Testing and Evaluation of Materials
最終更新：Dou Sun（）

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CCF正式名称インパクトファクター出版社ISSN
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