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IITC 2024: IEEE International Interconnect Technology Conference

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IITC
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Día de Entrega:
2024-02-12
Fecha de Notificación:
Fecha de conferencia:
2024-06-03
Ubicación:
San Jose, California, USA
Ediciones:
27
Vistas: 19590   Seguidores: 0   Asistentes: 0

Índice Conference Partner (CP-I)

50,2 / 100
Puesto n.º 1.523 de 5.682 congresos · 27% superior
Reconocimiento académico (35%) Sin datos: se puntúa con la línea base neutra de 50 —
Selectividad en la revisión (20%) Sin datos: se puntúa con la línea base neutra de 50 —
Ediciones celebradas (20%)
90
Atención de la comunidad (10%)
10
Integridad del registro público (15%)
25

Datos utilizados: Ediciones documentadas: 27 · Investigadores que abrieron esta página en los últimos 24 meses: 3

Falta en el registro público: Tasas de aceptación históricas (+4,5) · Ediciones anteriores (+3,0) · Premios al mejor artículo (+2,3)
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Solicitud de Artículos

IITC 2024 (IEEE International Interconnect Technology Conference) is an academic conference held in San Jose, California, USA on 2024-06-03. The paper submission deadline is 2024-02-12.

The 27th edition of the International Interconnect Technology Conference (IITC) will be held June 3-6, 2024 in San Jose, California. Authors are encouraged to submit their original work describing innovative research and development in the critically important field of on-chip interconnects. The conference seeks papers on all aspects of BEOL/MOL interconnects and metallization, including design, unit process, integration and reliability. The deadline for submission of abstracts is February 12, 2024. IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications. The conference seeks papers on all aspects of BEOL/MOL interconnects and metallization, including design, unit process, integration and reliability. Applications of Interest Advanced interconnects: low-k interconnects, optical, wireless, and carbon-based interconnects, Airgap, 1D/2D interconnects, beyond Cu… Emerging BEOL Integration flows such as semi-damascene 3D integration & packaging concerns: Wafer-to-Wafer/Chip-to-Wafer bonding, RDL’s and Interposers, Through Si Via, Non-destructive, high throughput methods to identify defects, backside power distribution network (BSPDN), thermal management Contacts on MOS devices: Silicide, III-V, 2D materials… Memory architecture: CBRAM, PCRAM, ReRAM, MRAM, FeRAM, DRAM, 3DNAND… Novel System and Emerging Technology: Energy harvesting, brain-inspired computing… Novel Form Factors: flexible electronics, wearables… Topics of Interest Process integration, advanced patterning for MOL/BEOL Materials and Unit Processes (Dielectrics, metals, barriers, Wet, CMP, PVD, CVD, ALD, selective deposition/SAMs, patterning, advanced cleaning and surface treatment) Reliability and Failure analysis, characterization, techniques, and methods Advanced material/process characterization, system-technology & design-technology co-optimization, and modelling techniques Abstract Information Abstracts must be no more than 3 pages in length. Details of abstract submission, including a template will be available shortly when the submission site is available. Submissions will be reviewed for acceptance as an oral presentation or poster. Accepted abstracts will be published digitally by IEEE as IITC Conference Proceedings without further changes.
Última actualización por Dou Sun el

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