期刊信息

Active and Passive Electronic Components (APEC)

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影响因子:
0.8
出版商:
Hindawi
ISSN:
0882-7516
浏览:
16674
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0

征稿

Active and Passive Electronic Components (APEC) is an academic journal published by Hindawi. (ISSN 0882-7516, impact factor 0.8).

Aims and scope Active and Passive Electronic Components is an international journal devoted to the science and technology of all types of electronic components. The journal publishes experimental and theoretical papers on topics such as transistors, hybrid circuits, integrated circuits, MicroElectroMechanical Systems (MEMS), sensors, high frequency devices and circuits, power devices and circuits, non-volatile memory technologies such as ferroelectric and phase transition memories, and nano electronics devices and circuits.
最后更新 Dou Sun 在

Special Issues

Special Issue on The 40th China Conference on Computer Applications (CCF NCCA 2025) 截稿日期: 2026-08-06 Description In recent years, the remarkable progress in computer application technologies, including Artificial Intelligence (AI), Big Data, Large Models, Blockchain, the Internet of Things (IoT), Cloud Computing, 5G, and Digital Twins, has deepened their integration across various industries. This rapid development has not only expanded the horizons of technological solutions but also introduced unprecedented complexity in the interoperability technologies required to connect industrial equipment, information systems, business processes, enterprise products and services, and personnel. Consequently, constructing a more efficient, secure, and intelligent computer application technology system has become a significant worldwide challenge. Addressing this challenge presents both opportunities and long-standing difficulties in modernizing intelligent systems. Moreover, the self-adaptive nature of intelligent models sets them apart in dealing with the dynamic and often unpredictable nature of engineering challenges. These models can continuously learn and adjust to changing external conditions, ensuring that the solutions they provide remain relevant and effective over time. This adaptability is particularly crucial in fields like transportation and environmental engineering, where the variables in play can shift rapidly due to factors such as environmental changes, policy updates, or technological advancements. The purpose of this Special Issue is to showcase the latest developments, opportunities, and applications of advanced computer applications. We invite the submission of high-quality papers from both academia and industry that address the technical challenges and harness the potential of intelligent methods in application of computer science and encourage the submission of original research articles and comprehensive review papers that explore all aspects of this interdisciplinary field, aiming to solve existing problems and pave the way for future innovations. The primary objective of this Call for Papers is to assess the current state-of-the-art in addressing these complex interoperability challenges through advanced computer application technologies, identify knowledge gaps, and propose future research directions. This initiative seeks to foster a comprehensive understanding of how AI, Big Data, and other emerging technologies can be leveraged to build robust, interconnected systems across diverse landscapes including industry and transportation. We envision that the collective insights and collaborative efforts showcased at this conference will inspire and guide future innovations, ultimately leading to the advancement of both computer application technologies and the traditional engineering disciplines they seek to transform. Potential topics include but are not limited to the following: Frontier Technology Applications of intelligent systems, including intelligent Energy, Manufacturing, Transportation, Finance, etc. Artificial intelligence technologies, including Large Models, Deep Learning, Feature Extraction and Selection Pervasive Computing and Environmental Intelligence Robotics and Intelligent Systems, including Virtual Reality, Augmented Reality, and Biometric Recognition Brain-Computer Interfaces Data Science and Big Data Technologies, including System Frameworks, Data Preprocessing, Visualization, Mining, and Privacy Cybersecurity Technologies including Future Grid Architectures, Distributed Computing, Cybersecurity, Mobile Communications Internet of Things and Sensor Networks Cloud Computing and Service Computing Smart Healthcare and Agriculture Editors Lead Guest Editor Chengliang Chai1 1Beijing Institute of Technology, Beijing, China Guest Editors Kaiyu Li1 | Zemin Chao2 | Yatao Bian3 1Wilfrid Laurier University, Waterloo, Canada 2Harbin Institute of Technology, Harbin, China 3National University of Singapore, Singapore, Singapore
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