Journal Information
Materials Letters
Please Login to view website of journal
Impact Factor:
2.7
Publisher:
Elsevier
ISSN:
0167-577X
Viewed:
26528
Tracked:
0
Call For Papers
Aims & Scope
Materials Letters is an interdisciplinary journal devoted to rapid communications on the science, applications, and processing of materials.
Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials.
Contributions include, but are not limited to, a variety of topics such as:
Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors, biomaterials and biological materials, advanced materials, metamaterials, high-entropy alloys, nitrides, and oxides.
Applications - Structural, opto-electronic, magnetic, biomedical, MEMS, sensors, electronics, smart materials, additive manufacturing, membranes, materials for energy systems, batteries, photocatalysis.
Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction.
Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots.
Processing - Crystal growth, thin film processing, sol-gel processing, solvo-hydrothermal processing, mechanical processing, assembly, nanocrystalline processing, sustainable/green processing routes.
Properties - Mechanical, magnetic, optical, electrical, ferroelectric/piezoelectric, thermal, interfacial, transport, thermodynamic, photoelectrochemical, photocatalytic, thermoelectric, biological, electrochemical.
Synthesis - Quenching, solid state, mechano-chemical, solidification, solution synthesis, vapor deposition, high pressure, explosive, MOVPE and LPE epitaxial processes, single crystal growth.
Machine Learning/Artificial Intelligence - Materials discovery, design of materials and digital materials science.
Last updated by Dou Sun in 2026-01-04
Related Journals
| CCF | Full Name | Impact Factor | Publisher | ISSN |
|---|---|---|---|---|
| Materials Today | 22.0 | Elsevier | 1369-7021 | |
| Materials & Design | 7.9 | Elsevier | 0264-1275 | |
| Materials Chemistry and Physics | 4.7 | Elsevier | 0254-0584 | |
| IEEE Communications Letters | 4.4 | IEEE | 1089-7798 | |
| c | Pattern Recognition Letters | 3.9 | Elsevier | 0167-8655 |
| c | IEEE Signal Processing Letters | 3.9 | IEEE | 1070-9908 |
| c | Neural Processing Letters | 2.8 | Springer | 1370-4621 |
| Materials Letters | 2.7 | Elsevier | 0167-577X | |
| Systems & Control Letters | 2.5 | Elsevier | 0167-6911 | |
| IEEE Solid-State Circuits Letters | 2.0 | IEEE | 2573-9603 |
Related Conferences
| CCF | CORE | QUALIS | Short | Full Name | Submission | Notification | Conference |
|---|---|---|---|---|---|---|---|
| c | a | a2 | LCN | IEEE Conference on Local Computer Networks | 2026-04-13 | 2026-06-29 | 2026-10-07 |
| a | b1 | FM | International Symposium on Formal Methods | 2025-11-25 | 2026-02-06 | 2026-05-18 | |
| c | a | a2 | IJCNN | International Joint Conference on Neural Networks | 2025-01-15 | 2025-03-31 | 2025-06-30 |
| b | a | a2 | SoCG | ACM Symposium on Computational Geometry | 2024-11-26 | 2025-02-06 | 2025-06-23 |
| b5 | LASCAS | Latin American Symposium on Circuits and Systems | 2024-09-27 | 2024-10-25 | 2025-02-25 | ||
| b4 | LANC | Latin America Networking Conference | 2024-05-17 | 2024-06-28 | 2024-08-15 | ||
| c | b1 | ICVS | International Conference on Computer Vision Systems | 2023-06-12 | 2023-07-13 | 2023-09-27 | |
| b | b1 | iFM | International Conference on integrated Formal Methods | 2022-02-11 | 2022-03-18 | 2022-06-07 | |
| b | b2 | CAIP | International Conference on Computer Analysis of Images and Patterns | 2019-04-01 | 2019-09-02 | ||
| b | b1 | CPM | Annual Symposium on Combinatorial Pattern Matching | 2015-02-02 | 2015-03-31 | 2015-06-28 |