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ISSCC 2027: IEEE International Solid-State Circuits Conference

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ISSCC
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Día de Entrega:
2026-09-09
Fecha de Notificación:
2026-10-21
Fecha de conferencia:
2027-02-14
Ubicación:
San Francisco, California, USA
Ediciones:
QUALIS: B1   Vistas: 41345   Seguidores: 19   Asistentes: 1

Índice Conference Partner (CP-I)

69,9 / 100
Puesto n.º 337 de 5.682 congresos · 6% superior

N.º 9 de 509 en Ingeniería eléctrica y electrónica

Reconocimiento académico (35%)
78
Selectividad en la revisión (20%) Sin datos: se puntúa con la línea base neutra de 50 —
Ediciones celebradas (20%)
100
Atención de la comunidad (10%)
43
Integridad del registro público (15%)
55

Datos utilizados: Categorías: QUALIS B1 · Ediciones documentadas: 74 · Investigadores que lo siguen aquí: 19 · Investigadores que abrieron esta página en los últimos 24 meses: 6

Falta en el registro público: Tasas de aceptación históricas (+4,5) · Premios al mejor artículo (+2,3)
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Confianza 80 %: la parte de la puntuación respaldada por datos observados y no por la línea base neutra. Cómo se calcula esta puntuación · Ver la clasificación · Versión del algoritmo 1.1 · Calculado el 2026-09-15

Solicitud de Artículos

ISSCC 2027 (IEEE International Solid-State Circuits Conference) is a QUALIS B1 conference held in San Francisco, California, USA on 2027-02-14. The paper submission deadline is 2026-09-09. Acceptance notifications are sent on 2026-10-21.

Topics of Interest ISSCC 2027 Conference Theme: Trusted Sustainable Silicon Intelligence from Edge to Cloud. This year’s theme highlights how circuit and system research enables secure, energy-efficient, and trustworthy intelligent IC and SoC innovations across the entire computing continuum, from ultra-low-power edge devices and sensors to high-performance cloud infrastructure. Innovative & Significant Submissions ISSCC seeks papers with outstanding innovation (e.g., novel circuit/system architectures) and/or significance (e.g., high-volume product deployment, advances in state-of-the-art metrics). Some innovative works may not have a best-in-class metric yet explore new architectures, challenge fundamental tradeoffs, or open new directions; industry firsts and state-of-the-art advances are equally welcome. A high level of technical quality and clarity is required for all submissions. Subject Areas ANALOG: Circuits with analog-dominated innovation; amplifiers, comparators, oscillators, filters, references; nonlinear analog circuits; digitally assisted analog circuits; sensor interface circuits; MEMS sensor/actuator interfaces, analog front-ends; analog circuits in sub-10nm scaled technologies. DATA CONVERTERS: Nyquist-rate and oversampling A/D and D/A converters; embedded and application-specific converters; time-to-digital converters; S&H circuits. Focus is on innovative and emerging converter architectures and integration advantages within larger systems, rather than the figure of merit of isolated converters. Consider converter peripherals (input, reference, clock drivers); calibration should focus on innovation, robustness, and practical usability. DIGITAL CIRCUITS, ARCHITECTURES & SYSTEMS*: Digital circuits, building blocks, architectures and HW optimizations of complete systems (monolithic, chiplets, 2.5D, 3D) for micro/application/graphics/automotive/ML/AI and SoC processors; accelerators for communications, video, cloud and datacenter; reconfigurable, near-/sub-threshold and approximate computing; intra-chip communication, clocking (PLLs/DLLs), soft-error/variation tolerance, power management; ML/AI systems including near- and in-memory computation and hardware for transformers, graph and spiking networks, and hyper-dimensional computing. IMAGE SENSORS & DISPLAYS**: Image sensors; vision sensors including event-based and computer sensors; LiDAR, time-of-flight and depth sensing; ML and edge computing for imaging; display drivers, touch sensing, haptic displays, and interactive display/sensing for AR/VR. MEDICAL**: Medical devices; biomedical sensors and SoCs; brain-computer and neural interfaces and closed-loop systems; wearable, implantable, and ingestible devices; ultrasound and medical imaging; medical optical microsystems; body-area networks; wireless power/communication to implants; ML and edge computing for medical applications; combinatorial innovation including sensor fusion for disruptive clinical outcomes. MEMORY: Static, dynamic, and non-volatile memories for stand-alone and embedded applications; memory/SSD controllers; high-bandwidth I/O for memories; phase-change, magnetic, STT, ferroelectric, and resistive memories; array architectures for low-voltage operation, power, reliability, performance, fault tolerance; in-memory and near-memory computing macros for AI and other applications. POWER MANAGEMENT: Power management, delivery, and control; switched-mode converter ICs (inductive, capacitive, piezoelectric, hybrid); LDO/linear regulators; power delivery for heterogeneous and 2.5/3D integration; gate drivers; wide-bandgap (GaN/SiC) designs; isolated and wireless converters; envelope supply modulators; energy harvesting; power management for automotive/harsh environments, robotics, LED drivers, and LiDAR. RF CIRCUITS & WIRELESS SYSTEMS***: Complete solutions and building blocks at RF, mm-Wave, and THz for receivers, transmitters, synthesizers, RF filters, front-end modules, multi-element transceivers, SoCs, and wireless SiPs with multiple chiplets; techniques and heterogeneous packaging for established and emerging wireless standards and novel applications such as sensing, radar, imaging, satellite communications, integrated sensing and communications, and IoT. SECURITY: Cryptographic accelerators (classical, PQC, FHE, and protocols such as ZKP, MPC, OT); smart-card security; trusted and confidential computing; secure processors and memories; security primitives (PUFs, TRNGs, secure OTPs, side-channel/fault countermeasures); security for resource-constrained systems; secure analog/mixed-signal/RF; secure supply chains; security for/with AI; secure system design and HW/SW co-design. TECHNOLOGY DIRECTIONS: Emerging IC, system, and device solutions: integrated photonics and silicon electronic-photonic integration; quantum devices for metrology/sensing/computing; flexible, stretchable, foldable, printable, and 3D electronics; biomedical/chemical sensors; wireless power transfer at distance; ICs for space and extreme environments; unconventional platforms for computing and ML including analog/mixed-signal; AI for analog automated IC design; integrated meta-materials and alternative device platforms. WIRELINE: Receivers/transmitters/transceivers for wireline systems: backplane, copper-cable, chip-to-chip, die-to-die, on-chip/on-package links, high-speed memory interfaces; optical links and silicon photonics; exploratory I/O for data rate, bandwidth density, power efficiency, equalization, robustness; building blocks such as AGCs, AFEs, ADC/DAC/DSPs, TIAs, equalizers, clock generation/distribution (PLLs/DLLs), clock recovery, line drivers, and hybrids.
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