Conference Information

AI3T 2026: International Conference on AI Infrastructure and Interconnect Technologies

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Submission Date:
2026-10-15 Due in 14 days
Notification Date:
2026-10-31
Conference Date:
2026-12-13
Location:
Hefei, China
Years:
1
Viewed: 28   Tracked: 0   Attend: 0

Conference Partner Index (CP-I)

37.0 / 100
Ranked #5,589 of 5,689 conferences · Top 99%
Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%)
19
Community attention (10%)
5
Public record completeness (15%)
35

Inputs used: Editions on record: 1 · Researchers who opened this page in the past 24 months: 1

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-10-01

Call For Papers

AI3T 2026 (International Conference on AI Infrastructure and Interconnect Technologies) is an academic conference held in Hefei, China on 2026-12-13. The paper submission deadline is 2026-10-15. Acceptance notifications are sent on 2026-10-31.

Scope and Topics We solicit original, high-quality research papers and practical experience reports on all aspects of AI infrastructure and interconnect technologies. Topics of interest include, but are not limited to: AI Infrastructure & Architecture Hyperscale AI training and inference system design Heterogeneous computing system integration and management Memory-centric and in-memory computing for AI High-Performance Interconnects & Optical Networking Electrical and optical interconnect technologies Intra- and inter-data center optical networking Ultra-high bandwidth and low-latency switching AI Accelerator & Heterogeneous Computing Networks Interconnect topologies for GPU, TPU, FPGA, and ASIC clusters Accelerator communication libraries and collective operations On-chip networks and advanced packaging Data Center & Scalable Network Architectures AI data center topologies and traffic engineering Lossless networking and congestion control In-network computing and compute-network convergence Distributed AI Training & Workload Orchestration Communication optimization for distributed training Co-scheduling of training and inference workloads AI resource pooling across clusters and domains Network Automation & AI-Native Operations AI for network prediction, operation, optimization, and self-healing Application of digital twins in network management and planning Intent-based networking and autonomous network operations Edge-to-Cloud Computing for AI Network architectures for distributed AI inference and training Latency and bandwidth management in edge-cloud pipelines Software and infrastructure for federated learning at scale Embodied AI & Robotic Infrastructure Compute and communication architectures for robot fleets and autonomous systems Low-latency edge processing for perception and control Networking for collaborative embodied intelligence Secure, Trustworthy & Sustainable AI Systems Hardware and network security for AI systems Verifiable and reliable AI execution Energy-efficient and sustainable AI infrastructure Emerging Interconnect Technologies & Standards Novel materials, devices, and paradigms for future interconnects Co-design of interconnects with AI workloads and programming models Industry standards and ecosystem development
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