Conference Information

FINE 2026: International Conference on Future and Intelligent Networking

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Submission Date:
2026-03-30
Notification Date:
2026-06-30
Conference Date:
2026-08-26
Location:
Osaka, Japan
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Call For Papers

FINE 2026 (International Conference on Future and Intelligent Networking) is an academic conference held in Osaka, Japan on 2026-08-26. The paper submission deadline is 2026-03-30. Acceptance notifications are sent on 2026-06-30.

FINE 2026 aims at bringing together interested parties (universities, research centers, industries and stakeholders) from around the world working in the fields of future and intelligent networking to exchange opinions, discuss brand-new ideas, developing innovative and emerging solutions, and establishing new collaborations. Scope and Objectives Future Networks, Artificial Intelligence (AI), and 6G are three of the most rapidly evolving fields of technology, which develop independently yet integrated with one another. The FINE represents the emerging networking technologies, integration of AI technologies into network systems, and supporting network technologies for future mobile communications. The conference will focus on the following areas: Future Mobile and Wireless Networks (5G-Advanced, 6G, Wi-Fi 8+) Open and Intelligent RAN (Open-RAN, vRAN, AI-RAN) Network Softwarization and Programmable Infrastructure AI for Network Design, Control, and Operations Network Automation, Analytics, and Management Networking for AI Systems and Data Centers Internet of AI Agents and Embodied AI Networks Semantic Communications and AI-Native Networking Cloud–Edge–Fog Computing and Network–Compute Co-Design IoT, Vehicular, and Industrial Networking Systems Non-Terrestrial and Extreme Networks (Space, Airborne, Maritime) Optical, Photonic, and High-Capacity Networks Security, Trust, Privacy, and Network Resilience Immersive, Tactile, and Content-Centric Networking Emerging and Disruptive Networking Technologies Experimental Platforms, Testbeds, and Real-World Deployments
Last updated by Dou Sun on

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