会议信息

WAMICON 2026: IEEE Wireless and Microwave Technology Conference

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截稿日期:
2026-02-06 已截稿
通知日期:
2026-03-09
会议日期:
2026-04-20
会议地点:
Clearwater, Florida, USA
届数:
27
浏览: 3710   关注: 0   参加: 0
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WAMICON
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会伴指数 (CP-I)

51.5 / 100
全站第 1,332 名 / 共 5,705 个会议 · 前 24%

电气与电子工程 第 65 / 512 网络与通信 第 188 / 866

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
90
社区关注 (10%)
8
资料公开度 (15%)
35

用到的输入: 有据可查的届次：27 · 过去 24 个月打开过本页的研究者：2 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后，可直接在这一页补上；分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.2 · 算于 2026-10-16

征稿

WAMICON 2026 (IEEE Wireless and Microwave Technology Conference) is an academic conference held in Clearwater, Florida, USA on 2026-04-20. The paper submission deadline is 2026-02-06. Acceptance notifications are sent on 2026-03-09.

The annual IEEE Wireless and Microwave Technology Conference (WAMICON 2026) plans an engaging program in Clearwater, Florida in April 2026. 2026 marks the 27th year anniversary of WAMICON which addresses multidisciplinary research and technology trends in RF, Microwaves, and Wireless Communications. The program includes both oral and poster presentations as well as workshops, tutorials and special sessions. Clearwater provides a convenient location to the Tampa International Airport (TPA) and the West Coast of Florida. We invite prospective authors to submit original and high-quality work for presentation at WAMICON 2026 and publication in IEEE Xplore. Conference website is www.wamicon.org WAMICON 2026 will be highlighting “Intelligent Heterogeneous Radio Hardware and Emerging Devices for Next-G Wireless and Beyond”. We welcome submissions on all aspects of RF, Microwave, Mm-wave Devices, Circuits and Systems along with hardware and software technologies enabling intelligent communications and sensing: Power Amplifiers (PAs), Active Components, and Systems High-Efficiency & Novel PAs, Linearization and Efficiency Enhancement Techniques, High-Power Devices, Linear/Nonlinear Device Modeling, Transceiver Design, Multi-Band and Digital RF Circuits and Systems, System-On-Chip/Package, Radar RF/MMIC Electronics, Active Filters, Reliability/Thermal Considerations, Wide Bandgap Semiconductors and Epitaxial Material Impacts. Passive Components and Antennas Filters, Transmission Line Components, Advanced Packaging, Antennas and Arrays, Novel Beam-Steering Techniques, Metamaterials, Metasurfaces, Frequency Selective Surfaces, Non-Foster Impedance Matching, Rectifiers. Mm-Wave to THz Technologies 5G/6G Communications, Backhaul, MIMO and Massive MIMO, Beamforming, Human Body Scanners, Radar, SatCom, Vehicle-to-Everything (V2x), Home/Office Application, Tactical Networks/Data Links, mm-wave Packaging, MEMS, and Integrated Circuits. Space & Emerging Applications CubeSats, SmallSats, FlatSats, Remote Sensors, Internet of Space, ASICS & Digital Back Ends, Optical Communications, Machine Learning, Spaceflight Qualification of Wireless Devices and Systems, Biomedical, Energy Harvesting, Wireless Power Transfer, Additive Manufacturing, Aerospace Applications of RF Circuits and System, Space Vehicle Com. Internet of Everything (IoE) & Machine Learning Automotive Systems, Health and Medical Sensors, Machine-to-Machine (M2M), Bluetooth Low Energy (BLE), Light Fidelity (Li-Fi), Near-Field Communication (NFC), RFID, Zigbee, Low-Power Wide-Area Network (LPWAN), Active Denial, Cognitive Radios and Software Defined Radios, Spectrum Management, Wireless Security, AI for RF and Systems, ML applications for RF and Microwave Devices and Systems.​ Authors are asked to submit papers electronically in .PDF format. In order to be considered for publication by the Technical Program Committee, a submission of 3-4 pages, clearly describing the concept and results must be submitted before the deadline of February 6, 2026. Submissions will be evaluated for originality, significance of the work, technical soundness, and interest to a wide audience. We encourage early paper submissions by international authors to accommodate U.S. Visa processing times. The steering committee will provide Visa letters, at the author's request, once the paper is accepted. Please review the following link for updated Visa processing times: https://travel.state.gov/content/travel/en/us-visas/business.html
由 Dou Sun 最后更新于

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