Conference Information

ICIEEE 2026: International Conference on Innovations in Electronics and Electrical Engineering

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Submission Date:
2026-06-16
Notification Date:
2026-07-12
Conference Date:
2026-09-11
Location:
Kuala Lumpur, Malaysia
Viewed: 3393   Tracked: 0   Attend: 0
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Conference Partner Index (CP-I)

43.6 / 100
Ranked #3,472 of 5,693 conferences · Top 61%

#278 of 511 in Electrical & Electronic Engineering

Limited evidence: this conference is not listed in CCF / ICORE / QUALIS and has no acceptance-rate data on file, so most of the score falls back to the neutral baseline.
Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%) No data - scored at the neutral baseline of 50 —
Community attention (10%)
8
Public record completeness (15%)
35

Inputs used: Researchers who opened this page in the past 24 months: 2

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 25% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-10-06

Call For Papers

ICIEEE 2026 (International Conference on Innovations in Electronics and Electrical Engineering) is an academic conference held in Kuala Lumpur, Malaysia on 2026-09-11. The paper submission deadline is 2026-06-16. Acceptance notifications are sent on 2026-07-12.

Below are thematic areas that we intend to collect from ICIEEE-2026 (International Conference on Innovations in Electronics and Electrical Engineering). These are aligned with meaningful domains and reflect contemporary research trends and practical industry relevance Track 1 - Advanced Electronics and Circuit Design Analog and Digital Circuits VLSI Design and Nanoelectronics Mixed Signal and RF Circuits MEMS and NEMS Technologies Track 2 - Power Systems and Energy Technologies Smart Grids and Intelligent Energy Systems Renewable Energy Integration (Solar, Wind, Hydro) Power Electronics and High Voltage Engineering Energy Storage and Battery Management Systems Track 3 - Embedded and Control Systems Embedded System Design and Applications FPGA and Microcontroller Innovations Cyber-Physical Systems Industrial Automation and Control Track 4 - Communication Systems and Networks Wireless and Mobile Communication 5G/6G Technologies and Future Networks Optical and Satellite Communication IoT and Sensor Networks Track 5 - Signal and Image Processing Audio, Speech, and Language Processing Biomedical Signal Processing Image and Video Processing Machine Learning in Signal Processing Track 6 - Robotics and Intelligent Systems Autonomous Systems and Drones Mechatronics and Human-Robot Interaction AI in Robotics and Automation Robotic Vision and Navigation Track 7 - Artificial Intelligence and Machine Learning Applications AI in Circuit Design and Fault Detection Predictive Maintenance for Electrical Systems Edge AI and Embedded Intelligence Neural Networks in Electronic Engineering Track 8 - Sustainable Technologies and Green Electronics Energy-Efficient Electronics Eco-friendly Device Fabrication E-Waste Management and Recycling Technologies Sustainable Power Conversion Analog and Digital Circuits VLSI Design and Nanoelectronics Mixed Signal and RF Circuits MEMS and NEMS Technologies Track 9 - General Antenna and Wave Propagation Microwave and Millimeter-Wave Engineering Photonic Devices and Optical Sensors EMI/EMC Technologies Automation and Industrial IoT (IIoT) Smart Manufacturing and Industry 5.0 Reliability and Safety in Industrial Systems Electrical Drives and Motor Control Biomedical Instrumentation Implantable Devices and Bioelectronics Health Monitoring Systems Smart Wearable Technology Quantum Circuits and Systems Quantum Communication and Cryptography Emerging Materials for Electronics Flexible and Printed Electronics
Last updated by Dou Sun on

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