Conference Information

MEMS 2027: International Conference on Micro Electro Mechanical Systems

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Submission Date:
2026-07-28
Notification Date:
2026-10-12
Conference Date:
2027-01-17
Location:
Big Island, Hawaii, USA
Years:
Viewed: 7829   Tracked: 0   Attend: 0

Call For Papers

MEMS 2027 (International Conference on Micro Electro Mechanical Systems) is an academic conference held in Big Island, Hawaii, USA on 2027-01-17. The paper submission deadline is 2026-07-28. Acceptance notifications are sent on 2026-10-12.

Reflecting the rapid growth of the MEMS field and the commitment and success of its research community, the IEEE MEMS Conference series has evolved into a premier annual event in the MEMS area. In recent years, the IEEE MEMS Conference has attracted more than 700 participants, 800+ abstract submissions and has created the forum to present over 200 select papers in non-overlapping oral and poster sessions. Its single-session format provides ample opportunity for interaction between attendees, presenters and exhibitors. The 40th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2027) is one of the premier annual events reporting research results on every aspect of MEMS and Microsystems technology, as well as their relevant technologies and industrial trends. In particular, IEEE MEMS 2027 will bring more industrial elements to broaden the impact towards various application scenarios, showing its significance on more-than-Moore era. IEEE MEMS 2027 will be held in Big Island, Hawaii, USA from 17 - 21 January 2027. The major areas of activity in the development of MEMS solicited and expected at this conference include but are not limited to: Design, simulation and analysis tools with experimental verification Fabrication technologies and processes Silicon and non-silicon materials Electro-mechanical integration techniques Assembly and packaging approaches Metrology and operational evaluation techniques System architecture The major areas of activity in the application of MEMS solicited and expected at this conference include but are not limited to: Mechanical, thermal, and magnetic sensors and actuators, and system Opto-mechanical microdevices and microsystems Fluidic microcomponents and microsystems Microdevices for data storage Microdevices for biomedical engineering Micro chemical analysis systems Microdevices and systems for wireless communication Microdevices for power supply and energy harvesting Nano-electro-mechanical devices and systems Scientific microinstruments
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