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MLCAD 2026: ACM/IEEE International Symposium on Machine Learning for CAD

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截稿日期:
2026-05-16
通知日期:
2026-07-07
会议日期:
2026-09-07
会议地点:
Jeju Island, South Korea
届数:
8
浏览: 12076   关注: 0   参加: 0
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资料公开度 (15%)
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用到的输入: 有据可查的届次：8 · 过去 24 个月打开过本页的研究者：9 人

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置信度 45% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-10-06

征稿

MLCAD 2026 (ACM/IEEE International Symposium on Machine Learning for CAD) is an academic conference held in Jeju Island, South Korea on 2026-09-07. The paper submission deadline is 2026-05-16. Acceptance notifications are sent on 2026-07-07.

About The symposium focuses on Machine Learning (ML) applications to all aspects of CAD for electronic circuits, chips and systems. It is sponsored by IEEE CEDA (Council on Electronic Design Automation) and ACM SIGDA (Special Interest Group on Design Automation). MLCAD 2025 will start with the welcome reception in the evening of September 7, 2025. Papers and presentations should cover one or more aspects of applying machine learning and AI to enhance CAD of chip designs. Such aspects include, but are not limited to, algorithms, software, models, example applications, benchmarking, and innovative solutions such as Large Language Models for CAD. Research Track Paper submission: Submissions should be full-length papers of up to six pages (PDF format, double-column, US letter size, font size 9pt or 10pt, using the ACM format). References and appendices are not included in the page limit. Submissions must be anonymous to allow a double-blind review process. Submitted papers must describe original work that has not been published/accepted and that is not currently under review. Symposium proceedings: Formal shared ACM/IEEE proceedings will be published containing all accepted papers and will be available through both IEEE Xplore Digital Library and ACM Digital Library. Accepted papers will be invited to submit an extended version in a special issue of ACM Transactions on Design Automation of Electronic Systems (TODAES).
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