Conference Information

ECSSP 2023: Asia Conference on Electronics, Circuits, Systems and Signal Processing

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Submission Date:
2023-08-05 Extended
Notification Date:
2023-08-10
Conference Date:
2023-08-25
Location:
Kunming, China
Viewed: 9213   Tracked: 0   Attend: 0

Conference Partner Index (CP-I)

42.1 / 100
Ranked #4,141 of 5,683 conferences · Top 73%

#354 of 509 in Electrical & Electronic Engineering

Limited evidence: this conference is not listed in CCF / ICORE / QUALIS and has no acceptance-rate data on file, so most of the score falls back to the neutral baseline.
Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%) No data - scored at the neutral baseline of 50 —
Community attention (10%)
8
Public record completeness (15%)
25

Inputs used: Researchers who opened this page in the past 24 months: 2

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 25% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-09-21

Call For Papers

ECSSP 2023 (Asia Conference on Electronics, Circuits, Systems and Signal Processing) is an academic conference held in Kunming, China on 2023-08-25. The paper submission deadline is 2023-08-05 (extended). Acceptance notifications are sent on 2023-08-10.

【IEEE/EI/CPCI检索】2023年亚洲电子、电路、系统和信号处理国际会议(ECSSP 2023) 2023 Asia Conference on Electronics, Circuits, Systems and Signal Processing (ECSSP 2023) 【会议官网】：http://www.ecssp.net/ 【会议地点】：昆明，中国 【会议日期】：2023年8月25-27日 *【出版与检索】: ★该会议接受的所有文章将发表在ECSSP 2023会议论文集里，由IEEE Conference Publishing Service出版，并提交IEEE Xplore，EI核心，Scopus和CPCI (ISTP)检索。 *【投稿方式】: 1.线上投稿系统: https://cmt3.research.microsoft.com/ECSSP2023 2.投稿邮箱: [email protected] 投稿指南: http://www.ecssp.net/Submission%20Guidelines.html *【联系方式】: 会议官网: http://www.ecssp.net/ 会议邮箱: [email protected] 电话咨询：13502461341(微信同号) QQ咨询：2056773349 若您有任何投稿或参会的疑问，请随时联系我们，您将得到最及时细致的回复。 *【会议简介】： 2023年亚洲电子、电路、系统和信号处理国际会议(ECSSP 2023)将于2023年8月25-27日在中国昆明举行。该会议由国际计算机应用技术学会举办，工程师技术研究所赞助。 在即将举行的该次会议上，我们邀请到学术领域的知名教授将与参会者分享在电子、电路、系统和信号处理领域的最新创新和研究成果。会议将主要以知名专家的主题演讲和作者的同行评审的论文报告为特色。此外，还将为参会者安排社交活动或学术访问，以促进该领域研究人员之间的交流、讨论与合作。 所有论文必须用英文撰写，并由大会技术委员会进行同行评审，所有被录用的论文将发表在会议论文集里，并提交IEEE Xplore, EI核心, Scopus和ISTP(CPCI)检索。 *【大会主讲嘉宾】： Prof. Witod Pedrycz, University of Alberta, Canada (IEEE Life Fellow) Prof. Ljiljana Trajkovic, Simon Fraser University, Canada (IEEE Fellow) Prof. Robert Minasian, The University of Sydney, Australia (IEEE Life Fellow) Chair Prof. (Kit) Kai-Kit Wong, University College London, UK (IEEE Fellow, IET Fellow) Prof. Zhe Chen, Aalborg University, Denmark (IEEE Fellow) Prof. Yang Han, University of Electronic Science and Technology of China, China Prof. Hartmut Hinz, Frankfurt University of Applied Sciences, Germany *【征稿主题】: 集成电路设计理论与技术 电子控制和仪表 嵌入式系统 电路和系统 电子设备 半导体器件和可靠性 物理电子学和光电子 通信中的电子设备 工业自动化与控制 VLSI设计与制造 光子技术 生物医学电子学 工业电子和自动化 数字集成电路和系统 电力和能源电路及系统 生物医学电路与系统 神经网络与神经形态工程 数字信号处理 多媒体系统和应用 汽车智能系统 智能安全系统 网络物理系统 可持续计算与系统 节能系统和服务 (更多会议主题: http://www.ecssp.net/Call%20for%20Papers.html ) *【投稿须知】： 1.会议的官方语言为英语，请务必用英语撰写论文。 2.请严格按照模板的格式修改文章格式（最好是在模板的基础上替换原文内容）。 3.文章页数要求不少于5页。 4.审稿周期为1-2周左右。 5.论文应为原创文章且从未公开发表，禁止抄袭，禁止一稿多投。 6.论文模板下载(WORD版本/Latex版本) 7.投稿后1-2周内出结果，审核快的话，7天之内就能出结果，早投稿早审核，早发录用通知。
Last updated by Linda Ye on

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