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A-SSCC 2022: Asian Solid-State Circuits Conference

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截稿日期:
2022-06-20 Extended
通知日期:
2022-08-01
会议日期:
2022-11-06
会议地点:
Taipei, Taiwan
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征稿

A-SSCC 2022 (Asian Solid-State Circuits Conference) is an academic conference held in Taipei, Taiwan on 2022-11-06. The paper submission deadline is 2022-06-20 (extended). Acceptance notifications are sent on 2022-08-01.

Prospective authors are invited to submit two-page manuscripts, including figures, tables and references, to the official A-SSCC 2022 website. The two-page submission could include one-page additional supplements with figures and figure captions. Supplementary figures should not be referred to in the text of the paper. For further details, see the A-SSCC Website. Papers are solicited in the following categories: Regular Session Analog Circuits & Systems: Amplifiers, comparators, switched capacitor circuits, continuous-time & discrete-time filters, voltage/current references; DC-DC converters, power-control circuits; IF/baseband analog circuits, AGC/VGA; non-linear analog circuits. Data Converters: Nyquist-rate and oversampling A/D, D/A converters, time-to-digital converters, and capacitance-to-digital converters; sub-circuits for data converters including sample-and-hold circuits, calibration circuits, etc. Digital Circuits & Systems: Design, fabrication, and test of digital VLSI systems; high-speed low-power digital circuits, power-reduction and management methods for digital VLSI, ultra-low-voltage and sub-threshold logic design; leakage reduction techniques; clock distribution, I/O circuits, reconfigurable logic-array circuits; supply/substrate noise measurement and cancellation for digital VLSI, variation and fault-tolerant circuits. SoC & Signal Processing Systems: System-on-chip (including 3D integration), microprocessors, network processors, baseband communication processing system & architectures, system-level power management; multimedia and recognition processing systems; cryptographic, security, machine learning, deep-learning, and neuromorphic circuits and systems; bio-medical/neural-network processors and sensor network systems. Wireless: Receivers/transmitters/transceivers for wireless systems; narrowband RF, ultra-wideband and millimeter-wave circuits; circuits and building-blocks including RF front-end, LNA, mixer, power amplifiers, VCOs, frequency synthesizers, RF filters, RF switches, power detectors, active antennas. Wireline: Receivers/transmitters/transceivers for wireline systems; optical/electrical data links and backplane transceivers; power-line communication; clock generation circuits, PLL, DLL, spread-spectrum clock generation; building blocks for high-speed wireline communication; analog-digital mixed-mode circuits. Emerging Technologies and Applications: Advanced system designs and circuit solutions for technologies and applications including state-of-the-art devices and packaging technologies; flexible and printable electronics; silicon photonics; smart sensors and transducers; MEMS for analog, RF, and sensor applications; image sensors and displays; energy harvesting systems; transceiver systems; medical/bio-electronics/bio-inspired chip design, artificial intelligent system, and cryogenic circuits and systems. Memory: Volatile and Non-volatile memory; new memory designs for 3D/2D architectures, emerging devices such as resistive-/phase change-/magnetic- /ferro-electric- memory devices; data storage and multi-bit-cell memory design; cache-memory system, multi-port memory, memory subsystem, processing in memory, and CAM design; yield-enhancing and ECC techniques; memory testing and built-in self-test. FPGA: Novel algorithm and/or architecture for integrated circuits validated by FPGA implementation. The authors of accepted papers are required to participate in demo sessions.
由 Dou Sun 最后更新于

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