会议信息

OICE 2026: International Conference on Optoelectronic Information and Computer Engineering

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OICE
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截稿日期:
2026-05-01
通知日期:
会议日期:
2026-05-15
会议地点:
Harbin, China
届数:
5
浏览: 16204   关注: 1   参加: 1

会伴指数 (CP-I)

44.6 / 100
全站第 2,978 名 / 共 5,693 个会议 · 前 53%

电气与电子工程 第 229 / 511

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
48
社区关注 (10%)
22
资料公开度 (15%)
35

用到的输入: 有据可查的届次：5 · 在会伴关注它的研究者：1 人 · 过去 24 个月打开过本页的研究者：7 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后，可直接在这一页补上；分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-10-04

征稿

OICE 2026 (International Conference on Optoelectronic Information and Computer Engineering) is an academic conference held in Harbin, China on 2026-05-15. The paper submission deadline is 2026-05-01.

OICE2026 invites submissions of applied or theoretical research as well as of application-oriented papers on all the topics of Optoelectronic Information and Computer Engineering. Topics include, but are not limited to the following: Optoelectronic Engineering Spectroscopy Photovoltaic technology Optoelectronics Engineering optics Solar cells Photoelectric signal processing Optical communication and optical network Optical fiber communication and system Photoelectric measurement, control and sensing Photoelectric materials and devices Laser principle and application Electronic circuit and technology Optical storage and display technology Other topics about optoelectronic engineering Information and Communication Engineering Satellite communication Signal and information processing Intelligent signal processing Array signal processing Communication and information system Switching and broadband network Electromagnetic field and electromagnetic wave Multimedia and image processing Wireless communication and data transmission Computer Engineering Computer components Computer storage technology Computer peripheral equipment Computer manufacturing and testing Computer processor technology Computer high-density assembly technology
由 Dou Sun 最后更新于

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