会议信息

ICKII 2026: IEEE International Conference on Knowledge Innovation and Invention

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截稿日期:
2026-06-15
通知日期:
2026-06-30
会议日期:
2026-08-14
会议地点:
Sendai, Japan
届数:
9
浏览: 17981   关注: 1   参加: 0

征稿

ICKII 2026 (IEEE International Conference on Knowledge Innovation and Invention) is an academic conference held in Sendai, Japan on 2026-08-14. The paper submission deadline is 2026-06-15. Acceptance notifications are sent on 2026-06-30.

Technical papers on the aspects related to (but not limited to) those in the topics of interest are invited for oral or poster presentation. The program committee encourages the submission of invited sessions with at least six manuscripts on a well-defined subject of current interest. If you are interested in this, please fill in the form by the online submission system http://www.ickii.org/. All papers in invited sessions will be subject to review and assessment by the Program committee. Topics of interest include as followings: A. Material Science & Engineering B. Communication Science & Engineering C. Computer Science & Information Technology D. Computational Science & Engineering E. Electrical & Electronic Engineering F. Mechanical & Automation Engineering G. Green Technology & Architecture Engineering H. Internet & IOT technology I. Applied Mathematics J. Innovation Design & Creative Design K. Industrial Design &Design Theory L. Cultural & Creative Research M. Additive Manufacturing N. Bioengineering O. Artificial intelligence P. Smart technology applications Q. Others
由 Dou Sun 最后更新于

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相关期刊

CCF全称影响因子出版商ISSN
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