会议信息
Cloud Summit 2024: IEEE International Conference on Cloud and Fog Computing Technologies and Applications
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截稿日期:
2024-03-01
通知日期:
2024-04-27
会议日期:
2024-06-27
会议地点:
Washington DC, USA
届数:
8
浏览: 15611   关注: 0   参加: 0

征稿
Description

The IEEE Cloud Summit conference was initialized in 2017. After seven consecutive successful years, Cloud Summit has grown to become a flagship conference with high-quality academic research presentations and industrial best practices. Cloud Summit conference features close interactions between industry and academia. It also features well-known researchers in cloud and edge computing, as well as industrial Cloud providers and practitioners.

The IEEE Cloud Summit 2024 is technically sponsored by the IEEE Computer Society Technical Committee on Cloud Computing (TCCLD) and hosted at the Catholic University of America.

In addition to keynote speeches, academic research paper presentations and poster sessions, the conference program features an industry track with invited talks and tutorials on cloud, fog, and big data techniques, as well as their applications in industries, presented by industry experts. The conference will provide networking opportunities to the stakeholders from across the world in the field of cloud and fog computing.

Paper and Posters

All accepted and presented papers/poster abstracts in IEEE Cloud Summit will be published in the conference proceedings by IEEE Computer Society’s Conference Publishing Services (CPS) and included in the IEEE Xplore.

The conference is organized with the following three tracks:

Track 1: Algorithm and Software

Machine Learning & AI with Cloud/Fog
Big Data Analytics
QoS in Cloud and Fog Computing
Cloud Forensics
Security and Privacy in Cloud/Fog

Track 2: System and Networking

Mobile Edge/Fog Computing System
Cloud-based Cyber-Physical System
Serverless Computing and Microservices
Cloud/Data center Networking
Energy/power efficiency

Track 3: Cloud/Edge Applications

Cloud Applications
Fog-Cloud Interaction
Low-Latency Edge Applications
Emerging Industry Products
Human and machine interaction
最后更新 Dou Sun 在 2023-12-02