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2IM 2021: International Conference on Intelligent Manufacturing and Intelligent Materials

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2IM
截稿日期:
2021-08-10 Extended
通知日期:
2021-08-30
会议日期:
2021-10-15
会议地点:
Shenyang, China
届数:
3
浏览: 23060   关注: 5   参加: 2

征稿

2IM 2021 (International Conference on Intelligent Manufacturing and Intelligent Materials) is an academic conference held in Shenyang, China on 2021-10-15. The paper submission deadline is 2021-08-10 (extended). Acceptance notifications are sent on 2021-08-30.

2IM 2021 focuses on intelligent manufacturing and intelligent materials. The topics are as following but not limited to: Intelligent Materials and Applications 1, Intelligent Materials (Shape material alloys, Piezo electric substances, Quantum tunneling composites, Electro Luminent substances, Photo chromic substances, Self-healing materials, Smart Polymeric Materials, etc) 2, The behavior and mechanics of intelligent materials 3, The applications of intelligent materials (Aerospace, Mass transit, Marine, Automotive, Computers and other electronic devices, Consumer goods applications, Civil engineering, Medical equipment applications, Rotating machinery applications) Intelligent Manufacturing 1, Intelligent Information Systems (Information and Decision Systems, Intelligent Databases & Information Retrieval, Data Analysis, Prediction & Model Identification, Prediction and Time Series Analysis, Data Fusion and Mining, System Identification, Multi-Level Measurement and Metrics, Control System 2, Manufacturing Systems and Technologies (Manufacturing and Service Systems, Flexible Automation and Intelligent Manufacturing, Modeling and Simulation, Digital machining technology, Micro, Nano and Desktop Manufacturing, Manufacturing Technology and Processes 3, Automation in Manufacturing (Industrial Robotics, Automation, and Process Control, Cognitive and Artificial Intelligence in Manufacturing, Sensor-Based Process Monitoring and Control 4, Intelligent Manufacturing Applications (Integrated Product and Production Development, Product Design/Design for Manufacture/Assembly, Modular and Configurable Structures and Development Processes, Product and Production System Life Cycle Assessment and Interaction)
由 Dou Sun 最后更新于

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相关期刊

CCF全称影响因子出版商ISSN
Journal of Intelligent Manufacturing7.4Springer0956-5515
International Journal of Intelligent Engineering and SystemsIntelligent Networks and Systems Society2185-310X
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IEEE Intelligent Systems6.1IEEE1541-1672
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