会议信息

ICMECM 2017: International Conferencen on Materials Engineering and Composite Materials

请登录查看会议网址
免费注册:查看官网链接、跟踪截稿日期,并接收邮件提醒。
嵌入截止倒计时徽章
ICMECM
用 API 获取这条数据
搜索与榜单列表完全无需凭证;本页的完整详情需要一把免费 API 密钥。详见开发者接入页。
截稿日期:
2017-07-31 Extended
通知日期:
2017-08-07
会议日期:
2017-11-23
会议地点:
Hong Kong, China
届数:
1
浏览: 12856   关注: 0   参加: 0

会伴指数 (CP-I)

35.8 / 100
全站第 5,616 名 / 共 5,687 个会议 · 前 99%

材料、机械与制造 第 259 / 260

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
19
社区关注 (10%)
8
资料公开度 (15%)
25

用到的输入: 有据可查的届次:1 · 过去 24 个月打开过本页的研究者:2 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后,可直接在这一页补上;分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据,而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-09-25

征稿

ICMECM 2017 (International Conferencen on Materials Engineering and Composite Materials) is an academic conference held in Hong Kong, China on 2017-11-23. The paper submission deadline is 2017-07-31 (extended). Acceptance notifications are sent on 2017-08-07.

T1: Advanced Materials Science Nanotechnology and Materials Semi-conductor Materials Magnetic Materials Electronic Materials Microelectronic Materials Hybrid Optical materials (organic/inorganic) Advanced Textile Materials New Functional materials Smart/Intelligent Materials/Intelligent Systems Materials Physics Materials Chemistry Biological medical materials Tooling Testing and Evaluation of Materials Modeling and simulation of materials and devices Quantum modulation based on superconductors, semiconductor and magnets T2:Engineering Materials Research Advanced Steels Advanced High Temperature Structural Materials Thin Films and Surface Engineering Light Metals and Alloys Metal materials Composites and Hybrid Materials Advanced Ceramic and Glass Materials Disordered and amorphous materials Novel photonic Materials and Devices Thermal Engineering Theory and Applications Building Materials Green Materials Light emitting material Energy Generation, Harvesting and Storage Materials Waste Engineering and Management T3: Materials Processing Technology Materials Forming Materials Machining Surface Engineering/Coatings Welding & Joining Low Cost Packaging Methods Laser Processing Technology Microwave Processing of Materials Processing technology for Functional materials Function test and evaluation technology for material analysis T4: Materials Related Issue Strength of Materials Fabrication Technologies Nanofabrication, nanometrology and applications Mechanical Behavior & Fracture Modeling, Analysis and Simulation of Manufacturing Processes Materials and engineered structures for light control Engineering Optimization System Analysis and Industrial Engineering Dynamic Mechanical Analysis, Optimization and Control Mechanical Control and Information Processing Technology Control of impurities, defects, traps Material computation and design Material Design of Computer Aided Computer-aided manufacturing, and engineering NOTE: Other related topics are also welcome.
由 Dou Sun 最后更新于

相关期刊

CCF全称影响因子出版商ISSN
Materials Science and Engineering: B5.7Elsevier0921-5107
Materials Science and Engineering: CElsevier0928-4931
Materials & Design8.2Elsevier0264-1275
Computational Materials Science3.3Elsevier0927-0256
Journal of Materials Processing Technology7.5Elsevier0924-0136
Optical Materials4.2Elsevier0925-3467
Materials Letters2.7Elsevier0167-577X
Materials DiscoveryElsevier2352-9245
AI & MaterialsELSP3006-7588
AIEEE Transactions on Multimedia9.7IEEE1520-9210

评论 0

暂无评论。

请登录后发表评论