Where is ICMECM 2017 held?

ICMECM 2017 is held in Hong Kong, China.

When does ICMECM 2017 take place?

ICMECM 2017 takes place on 2017-11-23.

Información de la conferencia

ICMECM 2017: International Conferencen on Materials Engineering and Composite Materials

Q: What is the submission deadline for ICMECM 2017?

The paper submission deadline for ICMECM 2017 (International Conferencen on Materials Engineering and Composite Materials) is 2017-07-31 (extended).

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Día de Entrega:

2017-07-31 Extended

Fecha de Notificación:

2017-08-07

Fecha de conferencia:

2017-11-23

Ubicación:

Hong Kong, China

Ediciones:

1

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Solicitud de Artículos

ICMECM 2017 (International Conferencen on Materials Engineering and Composite Materials) is an academic conference held in Hong Kong, China on 2017-11-23. The paper submission deadline is 2017-07-31 (extended). Acceptance notifications are sent on 2017-08-07.

T1: Advanced Materials Science Nanotechnology and Materials Semi-conductor Materials Magnetic Materials Electronic Materials Microelectronic Materials Hybrid Optical materials (organic/inorganic) Advanced Textile Materials New Functional materials Smart/Intelligent Materials/Intelligent Systems Materials Physics Materials Chemistry Biological medical materials Tooling Testing and Evaluation of Materials Modeling and simulation of materials and devices Quantum modulation based on superconductors, semiconductor and magnets T2:Engineering Materials Research Advanced Steels Advanced High Temperature Structural Materials Thin Films and Surface Engineering Light Metals and Alloys Metal materials Composites and Hybrid Materials Advanced Ceramic and Glass Materials Disordered and amorphous materials Novel photonic Materials and Devices Thermal Engineering Theory and Applications Building Materials Green Materials Light emitting material Energy Generation, Harvesting and Storage Materials Waste Engineering and Management T3: Materials Processing Technology Materials Forming Materials Machining Surface Engineering/Coatings Welding & Joining Low Cost Packaging Methods Laser Processing Technology Microwave Processing of Materials Processing technology for Functional materials Function test and evaluation technology for material analysis T4: Materials Related Issue Strength of Materials Fabrication Technologies Nanofabrication, nanometrology and applications Mechanical Behavior & Fracture Modeling, Analysis and Simulation of Manufacturing Processes Materials and engineered structures for light control Engineering Optimization System Analysis and Industrial Engineering Dynamic Mechanical Analysis, Optimization and Control Mechanical Control and Information Processing Technology Control of impurities, defects, traps Material computation and design Material Design of Computer Aided Computer-aided manufacturing, and engineering NOTE: Other related topics are also welcome.

Última actualización por Dou Sun el 2017-07-25

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