Conference Information
EPTC 2018: Electronics Packaging Technology Conference
Submission Date:
2018-07-27 Extended
Notification Date:
Conference Date:
Viewed: 3834   Tracked: 0   Attend: 0

Conference Location
Call For Papers

    Advanced Packaging: Advanced Flip-chip, 2.5D & 3D,PoP, embedded passives & actives on substrates, System in Packaging, embedded chip packaging technologies, Panel level packaging, RF, Microwave & Millimeter-wave, Power and Rugged Electronics Packaging etc.
    TSV/Wafer Level Packaging: Wafer level packaging ( Fan in/Fan out), embedded chip packaging, 2.5D/3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc.
    Interconnection Technologies: Au/Ag/Cu/Al Wire-bond / Wedge bond technology, Flip-chip & Cu pillar, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb-free) etc.
    Emerging Technologies: Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc.
    Materials and Processing: advanced materials such 3D materials, photoresist, polymer dielectrics, solder materials, die attach, underfill, Substrates, Leadframes, PCB etc for advanced packaging, and assembly processes using advanced materials.
    Equipment and Process Automation: new processes development, equipment automation, equipment hardware development/ improvements, data analytics, in-situ metrology.
    Electrical Simulations & Characterization: Power plane modeling, signal integrity analysis of package. 2D/2.5D/3D package level high-speed signal design, characterization and test methodologies, etc.
    Mechanical Modeling & Simulations: Thermo-mechanical, moisture, fracture, fatigue, vibration, shock and drop modeling, Chip-package interaction, etc.
    Thermal Characterization & Cooling Solutions: Thermal modeling and simulation, component, system and product level thermal management and characterization.
    Quality, Reliability & Failure Analysis: Component, board, system and product level reliability assessment, Interfacial adhesion, accelerated testing, failure characterization, etc.
Last updated by Dou Sun in 2018-07-23
Related Conferences
CCFCOREQUALISShortFull NameSubmissionNotificationConference
OMCSIEEE Conference on Optimization and Modeling of Complex Systems2020-06-282020-08-302020-12-12
NLPMLInternational Conference on Natural Language Processing and Machine Learning2019-11-232019-12-262020-01-25
BlockchainIEEE International Conference on Blockchain2020-03-012020-04-072020-08-02
SIPPRInternational Symposium on Signal, Image Processing and Pattern Recognition2019-11-202019-11-252019-12-12
ICIInternational Symposium on Intercloud and IoT2019-05-102019-05-302019-08-26
ICSEEAInternational Conference on Sustainable Energy Engineering and Application2016-07-312016-08-152016-10-03
FICCFuture of Information and Communication Conference2019-07-012019-08-152020-03-05
ICST'International Conference on Sensing Technology2018-07-212018-08-302018-12-03
b4TaPPUSENIX Workshop on the Theory and Practice of Provenance 2013-02-222013-04-02
BIGMLInternational conference on Big Data, Machine learning and Applications2020-02-222020-03-052020-03-21