会议信息

ICMSE' 2020: International Conference on Material Science and Engineering

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截稿日期:
2020-08-14 延期
通知日期:
会议日期:
2020-08-14
会议地点:
Guiyang, China
届数:
8
浏览: 23842   关注: 0   参加: 0
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ICMSE'
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会伴指数 (CP-I)

43.9 / 100
全站第 3,321 名 / 共 5,695 个会议 · 前 59%

材料、机械与制造 第 95 / 260

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
59
社区关注 (10%)
8
资料公开度 (15%)
25

用到的输入: 有据可查的届次:8 · 过去 24 个月打开过本页的研究者:2 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后,可直接在这一页补上;分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据,而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-10-11

征稿

ICMSE' 2020 (International Conference on Material Science and Engineering) is an academic conference held in Guiyang, China on 2020-08-14. The paper submission deadline is 2020-08-14 (extended).

The 8th Annual International Conference on Material Science and Engineering (ICMSE2020) will be held in Wuhan, Hubei, China at April 17-18, 2020. It is one of the leading international conferences for presenting novel and fundamental advances in the fields of Material Science and Engineering. The idea of the conference is for the scientists, scholars, engineers and students from the Universities all around the world and the industry to present ongoing research activities, and hence to foster research relations between the Universities and the industry. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. Submissions of papers describing original work in, but not limited to, the following topics are enthusiastically encouraged. 1. Energy and Environment Materials 2. Structural Materials 3. Functional Materials 4. Nano-scale and Amorphous Materials 5. Materials Processing and Genomic Engineering 6. Biomaterials and Healthcare 7. Electronic Materials 8. Optical Materials 9. Magnetic and Spintronic Materials 10. Carbon-based Materials 11. Other related topic ...
由 Dou Sun 最后更新于

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