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RSP 2016: IEEE International Symposium on Rapid System Prototyping

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투고 마감일:
2016-06-03
통보일:
2016-07-15
개최일:
2016-10-06
개최지:
Pittsburgh, Pennsylvania, USA
개최 횟수:
27
조회: 14148   팔로우: 0   참가: 0

논문 모집

RSP 2016 (IEEE International Symposium on Rapid System Prototyping) is an academic conference held in Pittsburgh, Pennsylvania, USA on 2016-10-06. The paper submission deadline is 2016-06-03. Acceptance notifications are sent on 2016-07-15.

The IEEE International Symposium on Rapid System Prototyping (RSP) emphasizes design experience sharing and collaborative approach between hardware and software research communities from industry and academy. It considers prototyping as an iterative design approach for embedded hardware and software systems. The RSP series of symposium aim at bridging the gaps in embedded system design between applications, architectures, tools, and technologies to achieve rapid system prototyping of emerging software and hardware systems. For its 27th venue, the Rapid System Prototyping symposium seeks original contributions related to this target, encompassing a wide scope ranging from formal methods for the verification of software and hardware systems to case studies of emerging embedded systems and technologies. The symposium proposes a two-day inspiring international forum for discussing the latest related innovations and research activities. The symposium program will include keynote speeches and technical papers on timely topics. The RSP symposium continues as a part of the Embedded Systems Week, that will be held this year in Pittsburgh, PA, USA. See http://www.esweek.org for more details. Suggested topics include, but are not limited to: Rapid prototyping and emulation methods and tools Specification models and methodologies for hardware/software systems Emerging technologies, devices, boards, and applications Prototyping experiences related to emerging technologies (memories, 3D integration, next generation wireless, Internet of Things) Prototyping of embedded systems for real-time, low power, and flexibility Hardware and software platforms for IoT systems Middleware for embedded systems Model-driven engineering and prototyping Formal methods and verification/validation of embedded systems Reliability and failure analysis for embedded systems Embedded system virtualization Virtual prototyping and platforms for embedded systems Prototyping methods and tools for reconfigurable computing Rapid design approaches for application-specific processors MPSoC and GPU-based system design and challenges Hardware platforms and approaches for simulations acceleration Industrial experiences in embedded system prototyping The program committee invites authors to submit original unpublished full papers. Authors of selected papers will be requested to prepare a final camera-ready manuscript for the symposium proceedings and must register and attend the symposium for their paper to be published. Each technical paper must be associated with an author registration at full rate. Paper length should not exceed 7 pages and should use the standard IEEE format. Submission instructions as well as templates can be found on the RSP web site http://www.rsp-symposium.org. Accepted and presented papers will be included in the IEEE RSP 2016 symposium proceedings and published in IEEE Xplore.
최종 수정: Dou Sun ()

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관련 저널

CCF정식 명칭영향력 지수출판사ISSN
Virtual and Physical Prototyping8.8Taylor & Francis1745-2759
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CKnowledge-Based Systems7.2Elsevier0950-7051
BSoftware & Systems Modeling3.2Springer1619-1366
AIEEE Transactions on Computers3.8IEEE0018-9340
CFuture Generation Computer Systems6.1Elsevier0167-739X
CNeurocomputing6.5Elsevier0925-2312
CPattern Recognition Letters3.9Elsevier0167-8655
BPattern Recognition7.6Elsevier0031-3203
IEEE Access3.6IEEE2169-3536

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