학회 정보

SSC 2017: IEEE International Conference of Scalable and Smart Cloud

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SSC
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투고 마감일:
2017-02-01
통보일:
2017-03-30
개최일:
2017-06-26
개최지:
New York City, New York, USA
개최 횟수:
3
조회: 14667   팔로우: 0   참가: 0

회반 지수 (CP-I)

39.5 / 100
전체 5,687개 중 5,164위 · 상위 91%
학술적 인정 (35%) 데이터 없음 — 중립 기준값 50점으로 계산 —
투고 선별성 (20%) 데이터 없음 — 중립 기준값 50점으로 계산 —
개최 횟수 (20%)
37
커뮤니티 관심도 (10%)
8
공개 자료 충실도 (15%)
25

사용한 입력: 확인되는 개최 횟수: 3 · 지난 24개월 동안 이 페이지를 연 연구자: 2명

공개 자료에서 빠진 항목: 역대 게재율 (+4.5) · 역대 회차 (+3.0) · 최우수 논문 기록 (+2.3)
주최자는 학회를 인증 신청한 뒤 이 페이지에서 바로 추가할 수 있습니다. 점수는 매일 밤 다시 계산됩니다. 이 점수를 올리는 방법

신뢰도 45% — 점수 중 중립 기준값이 아니라 실제 관측된 데이터에 근거한 비율. 이 점수는 어떻게 계산되나 · 전체 순위 보기 · 알고리즘 버전 1.1 · 산출일 2026-09-29

논문 모집

SSC 2017 (IEEE International Conference of Scalable and Smart Cloud) is an academic conference held in New York City, New York, USA on 2017-06-26. The paper submission deadline is 2017-02-01. Acceptance notifications are sent on 2017-03-30.

The emergency of smart cloud computing has enabled a great improvement in multiple industries. The concept of smart has been paid a high attention by both researchers and practitioners from different perspectives. The approach of achieving smart is being sought to reaching diverse aims, such as high performance computing, energy-aware solutions, green computing, and artificial intelligence. As a crucial technical trend, smart cloud is considered a critical dimension of cloud computing implementations and growths. Gathering contemporary research achievements in the field is remarkably significant for the research. We aim to collect the latest achievements and exchange research ideas in the domains of intelligent data and security at this academic event. Joining SSC 2017 will be a great opportunity for your to reach academics, professionals, and vendors who have the same research interests as yours. IEEE SSC 2017 is the next edition of a series of successful academic events, including SSC 2015 (New York, USA) and SSC 2016 (Beijing, China). IEEE SSC 2017 will be held at Columbia University in New York City. Submitted manuscripts should be written in English conforming to the IEEE conference proceedings format (8.5" x 11", Two-Column, template available at IEEE website. Full Papers (up to 6 pages complimentary, or 12 pages with the over length charge), Short Papers (up to 4 pages complimentary, or 5 pages with the over length charge). See Instructions for authors. All paper submissions must represent original and unpublished work. Topics of particular interest include, but are not limited to: New paradigms in cyber security Emerging attack methods Digital forensics and privacy issues in cloud computing Cyber monitoring approaches Big data security strategy Big data security issues in social networks Social engineering, insider threats, advance spear phishing Security and fault tolerance for embedded or ubiquitous systems Cloud users' privacy information protection Critical issues and solutions of Cyber security in tele-health Cyber security in mobile embedded systems New security cloud computing model, framework, and application Heterogeneous clouds and vulnerabilities Secure methods for heterogeneous cloud resource sharing Green cloud computing mechanisms Cloud-based audio/video streaming techniques Quality of Service (QoS) improvements techniques Case studies for cyber security applications Cloud-based real-time multimedia techniques New attack methods and applications Green cloud computing Quality of Service (QoS) improvements techniques Case studies for various applications Cloud-based sensor network and security issues
최종 수정: Dou Sun ()

관련 저널

CCF정식 명칭영향력 지수출판사ISSN
IEEE Solid-State Circuits MagazineIEEE1943-0582
IEEE Solid-State Circuits Letters2.0IEEE2573-9603
IEEE Cloud Computing MagazineIEEE2325-6095
Journal of Cloud ComputingSpringer2192-113X
IEEE Transactions on Smart Grid9.8IEEE1949-3053
AIEEE Transactions on Multimedia9.7IEEE1520-9210
CKnowledge-Based Systems7.2Elsevier0950-7051
BSoftware & Systems Modeling3.2Springer1619-1366
AIEEE Transactions on Computers3.8IEEE0018-9340
CFuture Generation Computer Systems5.9Elsevier0167-739X

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