Conference Information

EEETEM 2015: International Conference on Electrical and Electronic Engineering, Telecommunication Engineering, and Mechatronics

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Submission Date:
2015-09-27
Notification Date:
Conference Date:
2015-10-27
Location:
Kuala Lumpur, Malaysia
Viewed: 17907   Tracked: 0   Attend: 0

Conference Partner Index (CP-I)

42.1 / 100
Ranked #4,037 of 5,646 conferences · Top 72%

#293 of 470 in Robotics & Control #342 of 507 in Electrical & Electronic Engineering #634 of 862 in Networks & Communications

Limited evidence: this conference is not listed in CCF / ICORE / QUALIS and has no acceptance-rate data on file, so most of the score falls back to the neutral baseline.
Academic recognition (35%) No data - scored at the neutral baseline of 50
Submission selectivity (20%) No data - scored at the neutral baseline of 50
Editions held (20%) No data - scored at the neutral baseline of 50
Community attention (10%)
8
Public record completeness (15%)
25

Inputs used: Researchers who opened this page in the past 24 months: 2

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 25% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-08-30

Call For Papers

EEETEM 2015 (International Conference on Electrical and Electronic Engineering, Telecommunication Engineering, and Mechatronics) is an academic conference held in Kuala Lumpur, Malaysia on 2015-10-27. The paper submission deadline is 2015-09-27.

The conference aims to enable researchers build connections between different digital applications. The event will be held over three days, with presentations delivered by researchers from the international community, including presentations from keynote speakers and state-of-the-art lectures. RESEARCH TOPICS ARE NOT LIMITED TO: ***Electronics Engineering -Artificial Intelligence -Bioinstrumentation Sensors, Micro, Nano and Wearable Technologies -Circuits and Electronics -Communications and Networking -Computer Architecture for Intelligent Machines -Device Electronics for I.C -Electronic Medical Devices -Electronics & Nano Electronics -Electronics System-Level Based Design -FPGA and Reconfigurable Architecture based System -Fiber Optics and Fiber Devices -High Performance VLSI Systems -Integrated Optics -Intelligent Transportation Systems -Low-Power Signal Processing -MicroNano Systems and Networks -Mobile Computing -Multimedia Services and Technologies -Networks Design, Protocols and Management -Optical Electronic Devices & Photonics -Radio-Frequency Integrated Circuits -Robotic Systems -System on Chips and Network on Chips -Techniques of Laser and Applications Of Electro-optics ***Electrical Engineering -Analog Circuits and Digital Circuits -Analysis of Power Quality and System Stability -Antenna and Propagation -Battery Management System -Bioinformatics & Biomedical Imaging -Biomedical Signal Processing -Brain-Computer Interfacing and Human–Computer Interfacing -Computer Relaying -Computer-Aided Surgery -Data Compression and Watermarking -Electric Energy Processing -Electro-optical Phenomena of Semiconductors -Electromagnetic and Photonics -Expert Systems -Health Care Information Systems -Healthcare Information Systems, Telemedicine -Image Processing -Information Security and Cryptography -Integrated Optics and Electro-optics Devices -Internet and web solutions for healthcare -Microwave Theory and Techniques -Microwave and millimeter circuit and Antenna -Mobile Security -Modeling, Simulation, Systems and Control -Modulation, Coding, and Channel Analysis -Multimedia Signal Processing -Natural Language Processing -Neural Networks -Parallel Programming & Processing -Power Electronics -Power IC -Remote control and techniques of GPS -Robotics and Atomization Engineering -Signal Integrity Design for High-Speed Digital Systems -Signal Processing -Simulation of Propagation -Smart Grid -Speech Analysis and Synthesis -Speech Recognition -Wireless Communication ***Mechatronics -Applications of AI Techniques in Design and Manufacturing -Diagnosis and Monitoring in Mechatronic Systems -Automation -Mechanical Engineering -Industrial Engineering -Micro-Machining -Instrumentation and Control -Mechatronics -Modeling and Design -Nano Technology -Robotics and Automation -Control, Robotics And Mechatronics -Robotics and Mobile Machines -Design and Manufacturing -Dynamic Systems and Control -Mechatronics and Intelligent Machines -Globalization of Engineering -Microsystems Integration -NanoEngineering for Energy -Nano and Micro Materials, Devices and Systems -Computer-aided design, manufacturing, and engineering -Fault detection and Diagnosis in Mechatronics Systems -Automobile technology -Autonomous Systems and Ambient Intelligence -Bio-Mechatronics -Machining -Design and Green Manufacturing -Intelligent Processing of Materials -Human-Machine Interface -Micro-electro Mechanical Systems and Devices -Micromachining and Microsystem technology -Micromechatronics Researchers are encouraged to submit their work electronically. All papers will be fully refereed by a minimum of two specialized referees. Before final acceptance, all referees comments must be considered. PAPER SUBMISSION GUIDELINES: - Researchers are encouraged to submit their work electronically. Full paper must be submitted (Abstracts are not acceptable). - Submitted paper should not exceed 15 pages, including illustrations. All papers must be without page numbers. - Papers should be submitted electronically as pdf format without author(s) name. - Paper submission link httpsdiwc.netconferenceseeetem2015openconfopenconf.php IMPORTANT DATES: Submission Dates The submission is open from now until Sept. 27, 2015 Notification of Acceptance 3- 4 weeks from the submission date Camera Ready Submission October 17, 2015 Registration October 17, 2015 Conference Dates October 27-29, 2015
Last updated by Dou Sun on

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