Materials, Mechanical & Manufacturing - Call For Papers

CCF: Journal Rank (A, B, C) from China Computer Federation (2026)
Rank Systems
CCF: Journal Rank (A, B, C) from China Computer Federation (2026)

Conference Partner tracks 12 Materials, Mechanical & Manufacturing journals with an open call for papers, last refreshed 2026-11-08.

Showing 1-12 of 12 items.
CCFSpecial IssueSubmissionImpact FactorPublisher
Advanced Biomaterials in Stomatology and Beyond
Materials Science and Engineering: B
2026-11-185.7Elsevier
Precision Macromolecular Engineering and Functional Self-Assembly: Celebrating the 80th Birthday of Axel H.E. Müller
Polymer
2026-12-015.1Elsevier
Looking for more sustainable manufacturing technologies: Shaping our future
The International Journal of Advanced Manufacturing Technology
2026-12-313.1Springer
Optical Materials Research in Asia
Optical Materials
2026-12-314.2Elsevier
POLYMER’s European Future Faculty and Researchers: 2026 Award Winners
Polymer
2026-12-315.1Elsevier
High-temperature electrolysis and fuel cells: Novel electrode materials for efficient energy conversion; Electrochemical reaction processes and rate-limiting steps in electrode reaction processes
Materials Science and Engineering: B
2026-12-315.7Elsevier
High-temperature electrolysis and CO2 conversion: New materials for efficient CO2 catalysis; Electrochemical Reaction Processes and Rate-Limiting Steps in CO2 catalysis
Materials Science and Engineering: B
2026-12-315.7Elsevier
Advanced Packaging Techniques for Electronics and Optoelectronics
Materials Science in Semiconductor Processing
2026-12-314.6Elsevier
Polymer Science and Engineering across Ibero-Latin America
Polymer
2027-02-275.1Elsevier
Reversible Solid Oxide Cell Technologies: From Materials to Stacks (1)
Materials Science and Engineering: B
2027-02-285.7Elsevier
Energy Catalysis and Conversion Materials
Materials Science and Engineering: B
2027-02-285.7Elsevier
Emerging Two-Dimensional Semiconductor Materials for Electronic and Optoelectronic Applications
Materials Science in Semiconductor Processing
2027-03-314.6Elsevier