Conference Information
SIES 2024: International Symposium on Industrial Embedded Systems
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Conference Partner Index (CP-I)
#129 of 341 in Systems & Architecture
| Academic recognition (35%) |
|
60 |
| Submission selectivity (20%) | No data - scored at the neutral baseline of 50 | — |
| Editions held (20%) |
|
73 |
| Community attention (10%) |
|
22 |
| Public record completeness (15%) |
|
35 |
Inputs used: Listed as QUALIS B3 · Editions on record: 14 · Researchers following it here: 3 · Researchers who opened this page in the past 24 months: 2
Missing from the public record:
Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score
Confidence 80% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-09-14
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Based on the previous edition, the next deadline is estimated around 2027-06.
Call For Papers
SIES 2024 (International Symposium on Industrial Embedded Systems) is a QUALIS B3 conference held in Chengdu, China on 2024-10-23. The paper submission deadline is 2024-06-25 (extended). Acceptance notifications are sent on 2024-07-28.
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Related Journals
| CCF | Full Name | Impact Factor | Publisher | ISSN |
|---|---|---|---|---|
| Design Automation for Embedded Systems | 0.9 | Springer | 0929-5585 | |
| A | IEEE Transactions on Multimedia | 9.7 | IEEE | 1520-9210 |
| C | Knowledge-Based Systems | 7.2 | Elsevier | 0950-7051 |
| B | Software & Systems Modeling | 3.2 | Springer | 1619-1366 |
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| IEEE Access | 3.6 | IEEE | 2169-3536 |
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