会议信息

EEI'' 2026: International Conference on AI Driven Electrical, Electronics and Instrumentation Engineering

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截稿日期:
2026-09-06 已截稿
通知日期:
2026-11-05
会议日期:
2026-12-30
会议地点:
Online
届数:
9
浏览: 560   关注: 0   参加: 0
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会伴指数 (CP-I)

46.0 / 100
全站第 2,661 名 / 共 5,721 个会议 · 前 47%

电气与电子工程 第 207 / 514

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
62
社区关注 (10%)
8
资料公开度 (15%)
35

用到的输入: 有据可查的届次：9 · 过去 24 个月打开过本页的研究者：2 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
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置信度 45% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.2 · 算于 2026-10-19

征稿

EEI'' 2026 (International Conference on AI Driven Electrical, Electronics and Instrumentation Engineering) is an academic conference held in Online on 2026-12-30. The paper submission deadline is 2026-09-06. Acceptance notifications are sent on 2026-11-05.

9th International Conference on AI Driven Electrical, Electronics and Instrumentation Engineering (EEI 2026) aims to bring together researchers and practitioners from academia and industry to focus on recent systems and techniques in the broad field of electrical, instrumentation and communication Engineering. Original research papers, state-of-the-art reviews are invited for publication in all areas of Electrical Electronics & Instrumentation Engineering. Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to: Topics of interest include, but are not limited to, the following Advanced Power Systems Smart Grid andMicrogrid Technologies Energy Storage and Battery Management Systems AI for Power Systems and Grid Forecasting High Voltage Engineering and HVDC Systems Autonomous and Intelligent Control Systems Power System Resilience and Cyber Physical Security Analog, Mixed Signal and RFIC Design VLSI, Chipletsand 3D IC Integration Semiconductor Devices andNanoelectronics Post CMOS and Beyond Silicon Computing Advanced Packaging and Heterogeneous Integration AI Hardware, Neuromorphic and In Memory Computing Flexible, Wearable and Printed Electronics Electronics Reliability and Failure Prognostics RF, Microwave, mmWaveand THz Engineering THz Imaging, Sensing and Communications 6G Systems and Holographic MIMO Reconfigurable Intelligent Surfaces (RIS) Optical Networks and Silicon Photonics LEO Satellite Systems and Remote Sensing AI Driven Signal Processing Embedded Systems and Real Time Architectures Edge AI, TinyMLand Embedded ML Autonomous Robotics, UAVs and Intelligent Vehicles Bio Inspired and Soft Robotics Cyber Physical Systems and Digital Twins Mechatronics and Avionics Systems AI Driven Robotics Perception Advanced Sensors: MEMS, NEMS and Quantum Sensors Smart Sensing and Intelligent Instrumentation Biomedical Instrumentation and Neural Interfaces Precision Measurement and Time Synchronization Electro Optic and Photonic Sensing Hardware Security and Trusted Electronics Secure AI Hardware and Privacy-Preserving Circuits Information Systems and Network Security High Performance Computing: FPGA/GPU Acceleration AI Accelerated Optimization and Meta Heuristics Quantum Computing, Communication and Sensing Quantum Safe Cryptography System Modeling, Multi Physics and Co Simulation Digital Twins for Electrical and Industrial Systems Digital Twins for Semiconductor Manufacturing AI Enhanced EMC/EMI Modeling Sustainable and Green Electronics Industrial IoT, Smart Manufacturing and Industry 4.0 Electro Optic Computing and Hybrid Photonic Electronic Systems
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