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EDTM 2027: IEEE Electron Devices Technology and Manufacturing Conference

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EDTM
截稿日期:
2026-10-15 还有 93 天
通知日期:
2026-12-31
会议日期:
2027-03-08
会议地点:
Fukuoka, Japan
届数:
11
浏览: 20   关注: 0   参加: 0

征稿

EDTM 2027 (IEEE Electron Devices Technology and Manufacturing Conference) is an academic conference held in Fukuoka, Japan on 2027-03-08. The paper submission deadline is 2026-10-15. Acceptance notifications are sent on 2026-12-31.

IEEE EDTM 2027 – a Brief History IEEE Electron Devices Technology and Manufacturing (IEEE EDTM) Conference was established by the IEEE Electron Devices Society (EDS) to enable further performance/functionality enhancement of semiconductor devices and systems with manufacturing innovations to overcome scaling challenges. IEEE EDTM provides the forum where device, process, material, and tool communities gather and discuss their novel ideas for technological breakthrough. IEEE EDTM rotates among Asian countries where hot-hubs of semiconductor manufacturing are located. Launched in 2017 in Toyama, Japan, IEEE EDTM was subsequently held in Kobe, Japan (2018), in Singapore (2019), in Penang, Malaysia (2020), in Chengdu, China (2021), in Oita, Japan – Full virtual (2022), in Seoul, Korea (2023), in Bangalore, India (2024), in Hong Kong, China (2025), in Penang, Malaysia (2026), and will take place in Fukuoka, Japan this year. IEEE EDTM is a premier conference, providing a unique forum for discussions on a broad range of device/manufacturing-related topics. Mission of IEEE EDTM 2027 The 11th Electron Devices Technology and Manufacturing Conference (IEEE EDTM 2027) will be held in Fukuoka, a major hub in Japan known for its strong semiconductor industry and vibrant innovation ecosystem. IEEE EDTM 2027 is a full four-day conference to be held during March 8-11, 2027. IEEE EDTM 2027 aims to be a premier global forum for researchers and engineers from around the world coming to share new discoveries and discuss about any device/manufacturing-related topics, including but not limited to, materials, processes, devices, packaging, modeling, reliability, manufacturing and yield, tools, testing, and any emerging device technologies, as well as workforce training. The Theme for IEEE EDTM 2027 is: “Empowering the AI Era: The Role of Innovation in Semiconductor Devices and Manufacturing”
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