会议信息

MeETech 2026: International Conference on Mechatronics and Electronic Technology

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MeETech
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截稿日期:
2026-04-05
通知日期:
2026-05-15
会议日期:
2026-06-05
会议地点:
Jingdezhen, China
届数:
1
浏览: 2039   关注: 0   参加: 0

会伴指数 (CP-I)

37.7 / 100
全站第 5,538 名 / 共 5,687 个会议 · 前 98%

机器人与控制 第 450 / 470

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
19
社区关注 (10%)
12
资料公开度 (15%)
35

用到的输入: 有据可查的届次:1 · 过去 24 个月打开过本页的研究者:4 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后,可直接在这一页补上;分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据,而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-09-27

征稿

MeETech 2026 (International Conference on Mechatronics and Electronic Technology) is an academic conference held in Jingdezhen, China on 2026-06-05. The paper submission deadline is 2026-04-05. Acceptance notifications are sent on 2026-05-15.

The MeETech 2026 will focus on topics including mechatronics, intelligent robotics, advanced sensing and sensor fusion, AI-driven design, flexible electronics, and heterogeneous integration. We invite submissions on a range of topics including, but not limited to, the following: #1:Mechatronics Mechatronics Intelligent Robotics Digital Twin Edge Control AI-driven Design MEMS/NEMS E-Mobility Medical Robotics Green Manufacturing Predictive Maintenance Precision Motion Control Human-Robot Collaboration/HRI Vibration and Noise Control Advanced Sensing and Sensor Fusion Smart Actuators and Drives Industrial Internet of Things (IIoT) for Mechatronics Cyber-Physical Production Systems #2:Electronic Technology Power Semiconductors Wide-Bandgap RF Front-End AI Chip Flexible Electronics Silicon Photonics EMC 3D Packaging Green Electronics Quantum Devices Analog and Mixed-Signal Circuits Low-Power Design and Energy Harvesting Advanced Display Technologies Emerging Computing Architectures Power Management ICs (PMIC) Heterogeneous Integration Ultra-Low Temperature Electronics
由 Dou Sun 最后更新于

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