Conference Information

ICECCS'' 2027: International Conference on Electronics, Communications and Computer Science

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Submission Date:
2027-01-30 Due in 116 days
Notification Date:
2027-02-28
Conference Date:
2027-07-23
Location:
Chengdu, China
Years:
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ICECCS''
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Conference Partner Index (CP-I)

44.1 / 100
Ranked #3,235 of 5,693 conferences · Top 57%

#259 of 511 in Electrical & Electronic Engineering #504 of 865 in Networks & Communications

Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%)
30
Community attention (10%)
24
Public record completeness (15%)
55

Inputs used: Editions on record: 2 · Researchers who opened this page in the past 24 months: 24

Missing from the public record: Historical acceptance rates (+4.5) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-10-06

Call For Papers

ICECCS'' 2027 (International Conference on Electronics, Communications and Computer Science) is an academic conference held in Chengdu, China on 2027-07-23. The paper submission deadline is 2027-01-30. Acceptance notifications are sent on 2027-02-28.

The 2027 2nd International Conference on Electronics, Communications and Computer Science (ICECCS 2027) invites researchers, engineers, and practitioners worldwide to submit original contributions addressing cutting-edge advancements in the following areas but not limited to: Track 1: Advanced Electronics & Embedded System Wide-bandgap semiconductors (GaN, SiC) 3D integrated circuits (3D-IC) Low-power circuits Energy-efficient circuit architectures Near-threshold computing MEMS/NEMS sensors Power electronics Renewable energy systems Hardware security Hardware root-of-trust (PUF, TRNG) Trusted electronics Flexible electronics Stretchable electronics Wearable electronics Biomedical electronics Health monitoring systems In-memory computing Embedded AI Neuromorphic computing hardware RISC-V embedded processors AI accelerator for edge NPU Electronic design automation (EDA) Track 2: Communications & Networking Technologies 6G wireless communications Terahertz technologies Intelligent reflecting surface (IRS/RIS) AI-native air interface End-to-end learning for physical layer Quantum key distribution (QKD) Quantum repeaters Free-space optical communication Silicon photonics LEO satellite constellations Non-terrestrial networks (NTN) Open RAN (O-RAN) Cloud-native 5G/6G core Network function virtualization (NFV) Software-defined networking (SDN) Segment routing over IPv6 (SRv6) Time-sensitive networking (TSN) LPWAN (LoRa, NB-IoT, MIoTy) 5G RedCap Massive machine-type communications (mMTC) Wireless sensor networks Edge computing Network security Post-quantum cryptography (PQC) for networks AI-based intrusion detection Track 3: Computer Science & Intelligent Systems Large language models (LLMs) LLM compression (quantization, pruning) Multi-modal LLM (text + image + video) Retrieval-augmented generation (RAG) Agentic AI (LLM-based agents) Diffusion models Video generation (Sora-like models) Vision-language models (VLM) 3D Gaussian splatting Neural radiance fields (NeRF) Natural language processing Real-time speech translation Voice cloning Anti-spoofing detection Quantum computing algorithms Quantum computing architectures Confidential computing (TEE, SEV) Fully homomorphic encryption (FHE) Zero-knowledge rollups (zk-rollup) Serverless edge computing TinyML Battery-less sensing systems Brain-computer interface (BCI) Humanoid robotics Autonomous driving perception Multi-agent systems
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