会议信息

ECIE 2027: International Conference on Electronics, Circuits and Information Engineering

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截稿日期:
2027-03-04 还有 139 天
通知日期:
2027-04-04
会议日期:
2027-05-21
会议地点:
Nanjing, China
届数:
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学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
56
社区关注 (10%)
12
资料公开度 (15%)
55

用到的输入: 有据可查的届次：7 · 过去 24 个月打开过本页的研究者：4 人

公开资料里还缺: 历年录用率 (+4.5) · 最佳论文记录 (+2.3)
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置信度 45% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.2 · 算于 2026-10-16

征稿

ECIE 2027 (International Conference on Electronics, Circuits and Information Engineering) is an academic conference held in Nanjing, China on 2027-05-21. The paper submission deadline is 2027-03-04. Acceptance notifications are sent on 2027-04-04.

The topics of interest for submission include, but are not limited to: (1) Wireless Communication and Electromagnetic Technologies wireless communication antenna systems propagation and RF design microwave electronics electromagnetics emerging technologies 5G and beyond machine learning and optimization for wireless systems transmission and reception technologies reconfigurable intelligent surfaces and smart environments cognitive radio and AI networks green communications (2) Network Technologies and Services IoV IoT M2M sensor networks Ad hoc networks wireless networks protocols security and services mobile networks next-generation networks and internet wired networks optical networks and systems space-air-ground communication and space networks cloud and edge computing power system communication (3) Communication Theory and Signal Processing communication QoS reliability and modeling communication software physical layer and communication theory communication and information system security multimedia communication communication signal processing source-channel coding information and communication engineering underwater acoustic communication and maritime communication (4) Electronic Circuits and Integrated Circuits digital circuits and signal processing analog circuits and signal processing VLSI design and manufacturing semiconductor devices and circuits testing and reliability microcontroller technology low-power and energy harvesting technologies electromagnetic compatibility (5) Intelligent Transportation and Power Systems electric vehicles vehicular electronics and intelligent transportation electrified transportation and EVs power technology and smart grid integration UAV communication vehicular networks and telematics electrical engineering technologies electric machines and apparatus power and energy circuits (6) Intelligent Technologies and Emerging Applications positioning navigation and mobile satellite systems integrated sensing and communication semantic communication parallel and distributed computing measurement and control technologies and instrumentation sensing and sensor networks
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相关期刊

CCF全称影响因子出版商ISSN
Circuits, Systems, and Signal Processing2.0Springer0278-081X
AIEEE Transactions on Multimedia9.7IEEE1520-9210
CKnowledge-Based Systems7.2Elsevier0950-7051
BSoftware & Systems Modeling3.2Springer1619-1366
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