Conference Information

3DIM 2013: International Conference on 3-D Digital Imaging and Modeling

Please Login to view website of conference

Submission Date:
2013-04-02
Notification Date:
2013-05-03
Conference Date:
2013-06-29
Location:
Seattle, Washington, USA
Years:
10
CORE: c   QUALIS: b1   Viewed: 21048   Tracked: 1   Attend: 0

Call For Papers

3DIM 2013 (International Conference on 3-D Digital Imaging and Modeling) is a CORE C / QUALIS B1 conference held in Seattle, Washington, USA on 2013-06-29. The paper submission deadline is 2013-04-02. Acceptance notifications are sent on 2013-05-03.

Related Conferences

CCFCOREQUALISShortFull NameSubmissionNotificationConference
DIGITALAdvances on Societal Digital Transformation2021-09-252021-10-122021-11-14
aa*a1AAAIAAAI Conference on Artificial Intelligence2025-07-252025-11-032026-01-20
aa*a1SIGIRInternational Conference on Research and Development in Information Retrieval2026-01-152026-04-022026-07-20
aa*a1CVPRIEEE Conference on Computer Vision and Pattern Recognition2025-11-062026-02-202026-06-03
bba1ICRAInternational Conference on Robotics and Automation2025-09-152026-06-01
aa*a1IJCAIInternational Joint Conference on Artificial Intelligence2026-01-312026-08-15
aa*a1STOCACM Symposium on Theory of Computing2025-11-042026-02-012026-06-22
cba2ICCInternational Conference on Communications2025-10-132026-01-122026-05-24
caa2IJCNNInternational Joint Conference on Neural Networks2025-01-152025-03-312025-06-30
bba1ICASSPInternational Conference on Acoustics, Speech and Signal Processing2025-09-172026-01-162026-05-04

Related Journals

CCFFull NameImpact FactorPublisherISSN
Journal of Digital ImagingSpringer0897-1889
Journal of ImagingMDPI2313-433X
bIEEE Transactions on Multimedia9.7IEEE1520-9210
cKnowledge-Based Systems7.2Elsevier0950-7051
bSoftware & Systems Modeling3.2Springer1619-1366
aIEEE Transactions on Computers3.8IEEE0018-9340
cFuture Generation Computer Systems6.1Elsevier0167-739X
cNeurocomputing6.5Elsevier0925-2312
cPattern Recognition Letters3.9Elsevier0167-8655
IEEE Access3.6IEEE2169-3536