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EIEAI 2026: International Conference on Electronic Information Engineering and Artificial Intelligence

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Día de Entrega:
2026-09-04
Fecha de Notificación:
2026-09-11
Fecha de conferencia:
2026-09-18
Ubicación:
Nanchong, China
Ediciones:
Vistas: 4084   Seguidores: 0   Asistentes: 0

Índice Conference Partner (CP-I)

43,2 / 100
Puesto n.º 3.709 de 5.693 congresos · 66% superior

N.º 467 de 742 en Inteligencia artificial y aprendizaje automático

Reconocimiento académico (35%) Sin datos: se puntúa con la línea base neutra de 50 —
Selectividad en la revisión (20%) Sin datos: se puntúa con la línea base neutra de 50 —
Ediciones celebradas (20%)
30
Atención de la comunidad (10%)
16
Integridad del registro público (15%)
55

Datos utilizados: Ediciones documentadas: 2 · Investigadores que abrieron esta página en los últimos 24 meses: 7

Falta en el registro público: Tasas de aceptación históricas (+4,5) · Premios al mejor artículo (+2,3)
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Solicitud de Artículos

EIEAI 2026 (International Conference on Electronic Information Engineering and Artificial Intelligence) is an academic conference held in Nanchong, China on 2026-09-18. The paper submission deadline is 2026-09-04. Acceptance notifications are sent on 2026-09-11.

The 2026 2nd International Conference on Electronic Information Engineering and Artificial Intelligence (EIEAI 2026) will be held in Nanchong, Sichuan, China from September 18 to 20, 2026. Hosted by China West Normal University, the conference aims to bring together researchers and practitioners in electronic information engineering and artificial intelligence. All submissions will undergo peer review by 2-3 experts. Accepted papers will be submitted to IEEE for publication, included in IEEE Xplore, and submitted for EI Compendex and Scopus indexing. The previous EIEAI 2025 proceedings have been published and indexed by EI Compendex and Scopus. Original submissions are welcome in electronic information engineering, communication technologies, integrated circuits, intelligent sensing, AI algorithms, foundation models, computer vision, trustworthy AI, federated learning, and AI-driven fault diagnosis. The topics of interest for submission include, but are not limited to: Electronic Information Engineering · Low-Power RF Integrated Circuit Design · Microwave System Design and Applications · 5G-A/6G Physical Layer Key Technologies · Wide Bandgap Semiconductor Device Applications · Optoelectronic Integrated Devices & Systems · Mixed-Signal Circuit Design & Optimization · Terahertz Communication Technology & Systems · Electromagnetic Compatibility Design for Electronic Systems · MEMS Intelligent Sensing & Integration · High-Speed Digital Signal Integrity Optimization · Embedded Electronic System Development · Automotive Electronic Controller Design · Semantic Communication Protocol Optimization · Electronic Packaging Thermal Management Technology · Flexible Electronics & Wearable Devices · Satellite-Terrestrial Collaborative Communication · V2X Communication Security & Anti-Interference · Medical Electronic Equipment R&D · Electronic System Fault Diagnosis Technology · System-on-Chip (SoC) Integration Design · Low-Power Technology for Edge Electronic Devices · Communication Signal Detection & Demodulation Algorithms · LED Epitaxy & Optoelectronic Device Packaging · Industrial Electronic Control System Design Artificial Intelligence · Multimodal Large Model Fusion · Reinforcement Learning for Decision Optimization · Computer Vision Object Detection · Graph Neural Network Applications · Generative AI Content Creation · Natural Language Processing & Understanding · Federated Learning for Privacy Protection · Lightweight AI Model Deployment · Trustworthy AI & Robustness Optimization · Few-Shot/Zero-Shot Learning · AI-Driven Data Mining · Neural Architecture Search · Attention Mechanism Optimization · AI-Assisted Electronic Circuit Design · Time-Series Prediction AI Algorithms · Explainable AI Technology · Adversarial AI Defense · AI for Communication Network Optimization · Spiking Neural Networks · Transfer Learning Strategies · AI-Driven Fault Diagnosis · Multi-Agent Collaborative Control · AI-IoT Integrated Applications
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