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RFIC 2024: Radio Frequency Integrated Circuits Symposium

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Día de Entrega:
2024-01-09
Fecha de Notificación:
Fecha de conferencia:
2024-06-16
Ubicación:
Washington DC, USA
Vistas: 10715   Seguidores: 1   Asistentes: 0

Índice Conference Partner (CP-I)

43,0 / 100
Puesto n.º 3.762 de 5.682 congresos · 67% superior

N.º 315 de 509 en Ingeniería eléctrica y electrónica

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17
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25

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Solicitud de Artículos

RFIC 2024 (Radio Frequency Integrated Circuits Symposium) is an academic conference held in Washington DC, USA on 2024-06-16. The paper submission deadline is 2024-01-09.

The 2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2024) is the premier forum focused exclusively on presenting the latest research results in RF, millimeter-wave, and wireless integrated circuits. Continuing in 2024: RFIC has expanded its focus to include systems, applications, and interactive demonstrations, including mobile systems for 5G and beyond, radar, imaging, satellite communications, terahertz, biomedical, and optoelectronic systems. Technical Areas: The symposium solicits papers describing original work in all areas related to RF, mm-Wave, THz, and wireless systems and ICs. Work must be demonstrated through IC hardware results and measurements. • Wireless Radios and Systems-on-Chip: innovative circuit and system-on-chip concepts related to software-defined radio, interference cancellation, full-duplex, cellular/WiFi, GPS, low-power radio circuits for sensors, IoT and biomedical applications, radio architectures suitable for energy harvesting, wake-up receivers, etc. • Sub-D band mm-Wave Circuits: >20GHz <110GHz circuits for wireless communication, including phase shifters, phased arrays, beamformers, MIMO transceivers, and other systems for 5G applications. • Radar, Imager, and Sensor: integrated and vehicular radar, imaging, spectroscopy, MEMs-based sensors and actuators, and sensing circuits at RF through THz frequencies. • Transmitters and Power Amplifiers: for RF through mm-Wave, D-band, and higher frequencies, power amplifiers, drivers, modulators, digital transmitters, advanced TX circuits, linearization, and efficiency enhancement techniques. • Front-End Circuits: LNAs, mixers, VGAs, T/R switches, integrated FEM, amplifiers, filters, and demodulators. • Wireline, Optical, Quantum and Mixed-Signal Circuits: baseband and RF converters (ADC/DAC), sub-sampling/over-sampling circuits, converters for digital beamforming or emerging architectures, power (DC-DC) converters for RF applications, conversion techniques for wireline or optical connectivity (I/O transceivers and CDRs), silicon photonics, quantum computing ICs, hardware security, and AI applied to RF circuits. • Oscillators and Frequency Synthesizers: for RF through mm-Wave frequencies, D-band and higher, VCOs, injection-locking frequency dividers/multipliers, PLLs, DLLs, MDLLS, DDS, LO drivers, and frequency dividers. • Device/Packaging/Modeling and Testing Technologies: RF device technology (both silicon and compound semiconductors), MEMs, integrated passives, photonic technologies, reliability, packaging, modeling and testing, EM modeling/co-simulation, built-in-self-test (BIST), 3D ICs, and novel THz solutions. • D-band Circuits: >110GHz circuits and SOCs for wireless communication, including transceivers, transmitters, and other systems for 6G applications. • RFIC System Applications: system-level innovations in RFICs with application to 5G and beyond, radar, imaging, satellite communications, terahertz, biomedical, and optoelectronic systems. May include interactive demonstration and presentation of complete systems based on new or previously published chips. Additional details can be found on the RFIC website.
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