Conference Information

ICMEA' 2024: International Conference on Materials Engineering and Applications

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Submission Date:
2023-11-15
Notification Date:
2023-11-29
Conference Date:
2024-01-19
Location:
Okinawa, Japan
Years:
7
Viewed: 7886   Tracked: 0   Attend: 0

Call For Papers

ICMEA' 2024 (International Conference on Materials Engineering and Applications) is an academic conference held in Okinawa, Japan on 2024-01-19. The paper submission deadline is 2023-11-15. Acceptance notifications are sent on 2023-11-29.

With the rapid development of industry and information technology, researchers in all fields begin to discuss some new ideas connected with materials engineering and application. ICMEA will provide a valuable opportunity for researchers, scholars and some scientists to exchange their ideas face to face together. The conference attracts participants in a diverse range of fields, including materials engineering and application and some other related fields. Topics of interest for submission include, but are not limited to: Materials Science and Engineering, Materials Processing Technology Metallic Alloys, Tool Materials, Superplastic Materials, Ceramics and Glasses, Composites, Amorphous Materials, Nanomaterials, Biomaterials, Multifunctional Materials, Smart Materials, Engineering Polymers, Functional materials, Nuclear fuel materials, Biomaterals, sensors and surfaces, Thin Film Chalcogenide Photovoltaic Materials, Nuclear Materials IV, Magnetic Materials, Multi Functional Magnetic Materials, Superconducting Materials, Structured Materials, Spintronics Materials and Devices, Hard/Soft Magnetic Materials, Crosscutting materials Materials Properties, Measuring Methods and Applications Ductility, Crack Resistance, Fatigue, Creep-resistance, Fracture Mechanics, Mechanical Properties, Electrical Properties, and Magnetic Properties, Corrosion, Erosion, Wear Resistance, Non-Destructive Testing, Reliability Assessment, Toxicity, Working Properties of Materials and Products, Large Scale Applications, Electronics Applications.
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