会议信息

SMMP 2022: International Conference on Smart Manufacturing and Material Processing

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SMMP
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截稿日期:
2022-08-10 Extended
通知日期:
2022-08-10
会议日期:
2022-08-12
会议地点:
Shanghai, China
浏览: 8202   关注: 0   参加: 0

会伴指数 (CP-I)

42.1 / 100
全站第 4,052 名 / 共 5,645 个会议 · 前 72%

材料、机械与制造 第 133 / 259

证据有限:这个会议不在 CCF / ICORE / QUALIS 任何一份榜单里,也没有录用率数据,因此分数的大部分回落到了中性基准。
学术认可 (35%) 无数据 —— 按中性基准 50 分计入
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入
会议传承 (20%) 无数据 —— 按中性基准 50 分计入
社区关注 (10%)
8
资料公开度 (15%)
25

用到的输入: 过去 24 个月打开过本页的研究者:2 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后,可直接在这一页补上;分数每晚重算。如何提升这个分数

置信度 25% —— 分数中有多大比例来自实际观测到的数据,而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-09-01

征稿

SMMP 2022 (International Conference on Smart Manufacturing and Material Processing) is an academic conference held in Shanghai, China on 2022-08-12. The paper submission deadline is 2022-08-10 (extended). Acceptance notifications are sent on 2022-08-10.

Topics of interest for submission include, but are not limited to: Functional materials Smart materials & applications Materials processing and characterization Automation, control and information technology Materials processing and product manufacturing Surface treatment and machining Manufacturing technology Sensors and smart material systems Computational materials science Materials and technology Robotics and control Micro-fabrication technologies Advanced material processing and manufacturing Additive manufacturing and materials processing Industrial automation and process control Computer-aided design, manufacturing, and engineering Planning, optimization and simulation of manufacturing & materials processing
IAAST IAAST 最后更新于

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相关期刊

CCF全称影响因子出版商ISSN
Journal of Manufacturing Systems14.2Elsevier0278-6125
AIEEE Transactions on Multimedia9.7IEEE1520-9210
CKnowledge-Based Systems7.2Elsevier0950-7051
BSoftware & Systems Modeling3.2Springer1619-1366
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CFuture Generation Computer Systems5.9Elsevier0167-739X
CNeurocomputing6.5Elsevier0925-2312
CPattern Recognition Letters3.9Elsevier0167-8655
BPattern Recognition7.6Elsevier0031-3203
IEEE Access3.6IEEE2169-3536

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